EP3SL110F780I4N

The EP3SL110F780I4N is an industrial-grade Stratix® III L FPGA in a 780-ball FCBGA package designed for high-density digital integration. It provides a large programmable fabric with 107,500 logic elements, approximately 4.992 Mbits of embedded RAM, and 488 user I/O pins, enabling complex custom logic, data buffering, and high-pin-count interfacing within a compact surface-mount footprint.

Key Features

• Core Density 107,500 logic elements that support substantial gate-count implementations and complex combinational/sequential logic designs.
• Embedded Memory Approximately 4.992 Mbits of on-chip RAM for data buffering, FIFOs, and local storage to support high-throughput designs.
• High Pin Count I/O 488 user I/O pins to accommodate multiple interfaces and parallel data paths without external multiplexing.
• Power Supported core voltage range from 0.86 V to 1.15 V to match system power rails and enable proper core operation across specified conditions.
• Packaging & Mounting Surface-mount 780-FBGA package (29 × 29 mm) providing a compact, high-density package for board-level integration.
• Operating Conditions Industrial temperature rating from −40 °C to 100 °C for deployment in temperature-demanding environments.
• Regulatory Compliance RoHS compliant to meet regulatory requirements for lead-free assembly.

Typical Applications

• High-Density Digital Systems Large programmable fabric and abundant I/O support custom digital logic implementations and system glue logic.
• Data Buffering and Signal Processing Embedded RAM capacity enables on-chip buffering and intermediate storage for streaming data paths.
• Interface Aggregation High I/O count allows aggregation of multiple parallel interfaces and external peripherals on a single device.

Unique Advantages

• Substantial Logic Capacity: 107,500 logic elements enable integration of complex FPGA functions that reduce external component count.
• Significant On-Chip Memory: Approximately 4.992 Mbits of embedded RAM reduces reliance on external memory for many buffering and storage needs.
• High I/O Integration: 488 I/O pins allow direct connection to multiple buses and peripherals, simplifying board routing and system partitioning.
• Industrial Temperature Range: Rated for −40 °C to 100 °C to support deployment in harsh or temperature-variable environments.
• Compact Surface-Mount Package: 780-FBGA (29×29 mm) offers a space-efficient footprint for high-density board designs.
• RoHS Compliant: Meets lead-free assembly requirements for modern manufacturing processes.

Why Choose EP3SL110F780I4N?

The EP3SL110F780I4N positions itself as a high-capacity, industrial-grade FPGA suited for designs that demand large programmable logic, substantial embedded memory, and high I/O density within a compact surface-mount package. Its combination of 107,500 logic elements, approximately 4.992 Mbits of on-chip RAM, and 488 I/O pins makes it appropriate for integrators building complex digital subsystems, high-throughput data paths, or multi-interface controllers.

With an operating voltage range of 0.86–1.15 V and an industrial temperature rating of −40 °C to 100 °C, this device offers predictable electrical and environmental characteristics that support long-term deployments and scalable designs.

Request a quote or submit an inquiry to obtain pricing and availability information for the EP3SL110F780I4N and to discuss how it can meet your design requirements.