EP3SL150F1152C3

The EP3SL150F1152C3 is an Intel Stratix® III L Field Programmable Gate Array (FPGA) provided in a 1152‑ball BGA (FCBGA) package. It combines a large logic fabric, substantial on‑chip memory, and a high I/O count to address complex digital design requirements.

With 142,500 logic elements, approximately 6.54 Mbits of embedded memory, and 744 I/O pins, this commercial‑grade device is suited for applications that require dense logic integration, extensive interfacing, and on‑chip storage within a surface‑mount BGA footprint.

Key Features

• Logic Capacity — 142,500 logic elements providing a large programmable fabric for implementing complex digital circuits.
• Logic Array Blocks — 5,700 logic array blocks to organize and scale logic resources across the device.
• Embedded Memory — Approximately 6.54 Mbits of on‑chip RAM for buffering, state storage, and intermediate data processing.
• I/O Density — 744 user I/O pins to support extensive external interfacing and system connectivity.
• Package — 1152‑BBGA, FCBGA (supplier package: 1152‑FBGA, 35×35) providing a compact surface‑mount solution.
• Power — Core voltage supply range from 0.860 V to 1.15 V allowing integration with varied power architectures.
• Operating Range — Commercial temperature rating of 0 °C to 85 °C suitable for standard commercial electronics.
• Mounting — Surface mount device optimized for PCB assembly in compact systems.
• Environmental — RoHS compliant.

Typical Applications

• Complex Digital Systems — Implement large, custom logic functions and state machines using the 142,500 logic elements and 5,700 logic array blocks.
• Embedded Memory‑Intensive Designs — Use approximately 6.54 Mbits of on‑chip RAM for buffering, lookup tables, and intermediate data storage without external memory.
• High‑I/O Interface Platforms — Support multi‑channel sensor arrays, parallel buses, or extensive peripheral connectivity with 744 I/O pins.
• Commercial Electronics — Integrate into consumer and commercial systems that operate within a 0 °C to 85 °C range and require RoHS compliance.

Unique Advantages

• High Logic Density: 142,500 logic elements enable implementation of large-scale custom logic and complex algorithms on a single device.
• Substantial On‑Chip Memory: Approximately 6.54 Mbits of embedded RAM reduces reliance on external memory, simplifying board design and lowering BOM.
• Extensive I/O Count: 744 I/O pins provide flexibility for multi‑channel interfaces and dense peripheral connectivity.
• Compact BGA Package: 1152‑BBGA (35×35) delivers high pin count in a surface‑mount footprint suitable for space‑constrained PCBs.
• Design Flexibility: Wide logic array block distribution (5,700 blocks) allows partitioning of functions and scalable resource allocation.
• Regulatory Compliance: RoHS compliance supports modern environmental and manufacturing requirements.

Why Choose EP3SL150F1152C3?

The EP3SL150F1152C3 positions itself as a high‑capacity, commercially rated Stratix® III L FPGA for designs that demand large programmable logic, significant on‑chip memory, and broad I/O connectivity in a compact BGA package. Its combination of 142,500 logic elements, approximately 6.54 Mbits of embedded RAM, and 744 I/O pins makes it well suited for complex digital systems and interface‑dense applications.

Engineers and procurement teams looking for a RoHS‑compliant, surface‑mount FPGA from Intel for commercial electronics can rely on this device for scalable integration and board‑level consolidation where dense logic and memory resources are required.

Request a quote or submit an inquiry to get pricing, availability, and lead‑time information for the EP3SL150F1152C3.