EP3SL150F1152C3G

The EP3SL150F1152C3G is an Intel Stratix III‑family FPGA optimized for high‑performance logic, DSP and embedded designs. It delivers substantial logic capacity and on‑chip memory in a compact surface‑mount package for commercial‑temperature applications.

This device provides approximately 142,500 logic elements, roughly 6.54 Mbits of embedded RAM, and 744 user I/O in a 1152‑FBGA (35×35) surface‑mount package. Core supply range is 0.86 V to 1.15 V and the device is rated for 0 °C to 85 °C; RoHS compliant.

Key Features

• Logic Capacity — Approximately 142,500 logic elements for dense, programmable logic implementations.
• Embedded Memory — Approximately 6.54 Mbits of on‑chip RAM (6,543,360 bits) suitable for dual‑port memory and FIFO buffers.
• I/O and Packaging — 744 user I/O pins in a 1152‑FBGA (35×35) surface‑mount package for high‑pin‑count system designs.
• Low‑Voltage Core — Core supply range 0.86 V to 1.15 V to support selectable performance and power points.
• Clocking and PLLs — Family architecture supports multiple clock resources including up to 16 global clocks and up to 12 PLLs for complex timing and clock management.
• High‑Speed DSP — Stratix III family DSP resources include dedicated multipliers (9×9, 12×12, 18×18, 36×36) for hardware acceleration of signal processing functions.
• High‑Speed Serial I/O — SERDES and dynamic phase alignment circuitry in the family support high‑speed differential I/O (up to 1.6 Gbps) for networking and link interfaces.
• Security & Reliability — Family features include optional 256‑bit AES configuration encryption, CRC for configuration memory error detection, and ECC for embedded memory blocks.
• Compliance — RoHS compliant; commercial grade operating temperature 0 °C to 85 °C.

Typical Applications

• High‑Performance DSP — Accelerate filtering, FFTs and real‑time signal processing using the device’s dedicated multiplier and DSP resources.
• Networking & Communications — Implement packet processing, protocol bridging and high‑speed serial links leveraging SERDES and abundant I/O.
• Memory Interfaces — Build DDR/DDR2/DDR3 and specialized memory controllers using the device’s memory support and on‑chip DQS logic.
• Custom Logic & Prototyping — Replace or prototype ASIC functions with dense programmable logic and substantial embedded RAM.

Unique Advantages

• High logic density: Approximately 142,500 logic elements let you integrate complex functions on a single device and reduce system BOM.
• Significant embedded memory: Approximately 6.54 Mbits of on‑chip RAM supports large buffers, FIFOs and local data storage without external memory.
• Extensive I/O and compact package: 744 user I/O in a 1152‑FBGA (35×35) surface‑mount package provides high connectivity in a compact footprint.
• Power‑scalable core: Core supply range from 0.86 V to 1.15 V enables tradeoffs between performance and power consumption.
• Built‑in security and reliability: Optional 256‑bit AES configuration encryption and ECC/CRC features help protect configuration data and user memory.
• Rich clocking and DSP resources: Multiple global clocks, numerous PLLs and dedicated multipliers simplify implementation of timing‑critical and compute‑intensive functions.

Why Choose EP3SL150F1152C3G?

The EP3SL150F1152C3G combines high logic capacity, multi‑megabit embedded RAM and broad I/O in a single Stratix III‑family FPGA suitable for demanding logic, DSP and embedded system designs. Its core voltage range and family power‑management features allow designers to balance performance and power for commercial‑temperature applications.

This device is well suited to teams building high‑density programmable solutions that require substantial on‑chip memory, prolific I/O and hardware acceleration for signal processing or communications, while benefiting from the Stratix III family’s security and reliability features.

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