EP3SL150F1152C4

The EP3SL150F1152C4 is a Stratix® III L field programmable gate array (FPGA) in a 1152-BBGA FCBGA package, designed for high-density, programmable logic applications. It integrates approximately 142,500 logic elements, about 6.54 Mbits of embedded memory, and 744 I/O pins to support complex custom logic, on-chip data buffering, and dense external interfacing.

Available as a commercial-grade, surface-mount device with a 35×35 1152-FBGA supplier package, this device operates from 860 mV to 1.15 V core supply and over a 0°C to 85°C temperature range, making it suited for mainstream embedded and system-level designs.

Key Features

• Logic Capacity — Provides 142,500 logic elements to implement large-scale custom logic, data paths, and control functions.
• Embedded Memory — Contains approximately 6.54 Mbits of on-chip RAM for buffering, FIFOs, and local data storage to reduce external memory dependence.
• I/O Density — 744 user I/O pins to support multiple high-pin-count interfaces and parallel data streams.
• Package & Mounting — 1152-BBGA (FCBGA) package, supplier device package 1152-FBGA (35×35), optimized for surface-mount PCB assembly and high-density board layouts.
• Power — Core voltage supply range from 860 mV to 1.15 V to match low-voltage system architectures.
• Operating Range & Grade — Commercial grade device rated for operation from 0°C to 85°C.
• Environmental Compliance — RoHS compliant to meet environmental material restrictions.

Typical Applications

• High-density I/O systems — Use the 744 I/O pins for boards that require many external interfaces, parallel buses, or multi-channel I/O connectivity.
• Memory-intensive FPGA designs — Leverage approximately 6.54 Mbits of on-chip RAM for packet buffering, frame storage, or multi-queue FIFOs to minimize external memory bandwidth.
• Complex custom logic and prototyping — Deploy the 142,500 logic elements to implement large custom datapaths, protocol engines, or system controllers during development and deployment.

Unique Advantages

• Large programmable fabric: 142,500 logic elements enable implementation of extensive custom logic and parallel processing without partitioning across multiple devices.
• Substantial on-chip memory: Approximately 6.54 Mbits of embedded RAM reduces reliance on external memory for intermediate storage and buffering.
• High I/O count: 744 I/O pins support complex, multi-interface systems and high pin-count connectivity requirements.
• Compact, high-density package: 1152-FBGA (35×35) surface-mount package supports compact PCB layouts while maintaining thermal and routing capability for dense designs.
• Low-voltage core support: 860 mV to 1.15 V supply range enables compatibility with low-voltage system power domains.
• RoHS compliant: Meets common environmental material regulations for commercial electronics.

Why Choose EP3SL150F1152C4?

The EP3SL150F1152C4 positions itself as a high-capacity FPGA solution for designers who need a combination of large logic resources, significant on-chip memory, and a high I/O count in a compact FCBGA footprint. Its commercial-grade operating range and RoHS compliance make it suitable for mainstream embedded systems and high-density board designs.

This device is appropriate for teams implementing complex protocol engines, multi-channel I/O systems, or memory-buffered data paths who require a single-chip programmable solution that balances integration, power range compatibility, and board-level density.

Request a quote or submit your RFQ to check pricing and availability for the EP3SL150F1152C4 and to discuss volume, lead times, and supply options.