EP3SL150F1152C2N

IC FPGA 744 I/O 1152FBGA
Part Description

Stratix® III L Field Programmable Gate Array (FPGA) IC 744 6543360 142500 1152-BBGA, FCBGA

Quantity 1,174 Available (as of May 5, 2026)
Product CategoryField Programmable Gate Array (FPGA)
ManufacturerIntel
Manufacturing StatusObsolete
Manufacturer Standard Lead TimeRFQ
Datasheet

Specifications & Environmental

Device Package1152-FBGA (35x35)GradeCommercialOperating Temperature0°C – 85°C
Package / Case1152-BBGA, FCBGANumber of I/O744Voltage860 mV - 1.15 V
Mounting MethodSurface MountRoHS ComplianceRoHS CompliantREACH ComplianceREACH Unknown
Moisture Sensitivity Level4 (72 Hours)Number of LABs/CLBs5700Number of Logic Elements/Cells142500
Number of GatesN/AECCN3A001A7AHTS Code8542.31.0001
QualificationN/ATotal RAM Bits6543360

Overview of EP3SL150F1152C2N – Stratix® III L FPGA, 142,500 Logic Elements

The EP3SL150F1152C2N is a Stratix® III L Field Programmable Gate Array (FPGA) IC from Intel, packaged in a 1152-ball FCBGA (1152-FBGA, 35×35) surface-mount package. It combines a large logic array with substantial on-chip memory and a high I/O count to support complex, high-density digital designs.

Targeted for applications that require extensive fabric resources, embedded memory, and dense I/O, this device is suitable for systems integrating external memory interfaces, DSP functions, and high-speed I/O fabrics within a commercial temperature range.

Key Features

  • Logic Capacity  Approximately 142,500 logic elements providing a large programmable fabric for complex logic, control and datapath implementations.
  • Logic Array Blocks  5,700 logic array blocks (LABs) to structure logic resources for efficient synthesis and placement.
  • Embedded Memory  Approximately 6.54 Mbits of on-chip RAM (6,543,360 total RAM bits) for buffering, FIFOs, and on-chip data storage.
  • High I/O Density  744 I/O pins to support multiple external interfaces and parallel connections to memory and peripherals.
  • Power Supply  Nominal core voltage range from 0.860 V to 1.15 V for core power planning and supply design.
  • Package & Mounting  1152-BBGA (FCBGA) surface-mount package in a 35×35 ball format for high-density board-level integration.
  • Operating Temperature & Grade  Commercial grade operation from 0 °C to 85 °C for standard temperature-range applications.
  • Compliance  RoHS compliant to support lead-free manufacturing processes.
  • Documented Architecture  Supported by Stratix III device handbook material covering architecture, memory blocks, DSP blocks, clocking, I/O structure, and configuration.

Typical Applications

  • High‑Performance Signal Processing  On-chip DSP blocks and large logic and memory resources make the device suitable for implementing complex signal-processing pipelines.
  • Communications & Networking  High I/O count and support for external memory interfaces enable packet-processing, line-rate buffering, and protocol bridging.
  • Memory Interface Controllers  Resources and documented external memory interface support facilitate custom memory controller and interface designs.
  • Prototyping and System Integration  Dense logic fabric and extensive I/O enable system prototypes that require integration of multiple peripherals and subsystems on a single FPGA.

Unique Advantages

  • Large programmable fabric: 142,500 logic elements provide headroom for complex designs and parallel datapaths.
  • Substantial embedded memory: Approximately 6.54 Mbits of on-chip RAM reduces dependency on external memory for many buffering and storage needs.
  • High I/O count: 744 I/Os support multiple external interfaces and wide parallel buses without external multiplexing.
  • Compact, high-density package: 1152-ball FCBGA (35×35) enables a small board footprint for high-functionality systems.
  • Commercial temperature rating: 0 °C to 85 °C operation aligns with standard commercial deployments and system-level thermal plans.
  • Standards-based documentation: Stratix III device handbook material provides architecture, configuration, and design guidance to support development and integration.

Why Choose EP3SL150F1152C2N?

The EP3SL150F1152C2N delivers a combination of large logic capacity, substantial embedded memory, and high I/O density in a compact FCBGA package, making it well suited for advanced digital designs that demand significant on-chip resources. Its documented Stratix III architecture elements—memory blocks, DSP blocks, I/O structure, and configuration features—help engineers map complex algorithms and interface requirements into a single programmable device.

This device is ideal for teams building high-density, performance‑oriented systems in commercial environments who need a programmable solution with extensive resources, robust documentation, and RoHS compliance for lead‑free manufacturing workflows.

Request a quote or submit a procurement inquiry to get pricing and availability for the EP3SL150F1152C2N. Our team can provide technical support and ordering assistance to help integrate this Stratix III L FPGA into your next design.

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