EP3SL110F780I4LN

The EP3SL110F780I4LN is a Stratix® III L field programmable gate array (FPGA) IC from Intel, offering a high logic capacity in a FCBGA package. With 107,500 logic elements, approximately 4.99 Mbits of embedded RAM and 488 I/O pins, it addresses designs that require substantial on-chip logic, memory and high pin-count connectivity.

Key Features

• Core Logic — 107,500 logic elements provide large-scale programmable logic capacity for complex custom digital functions.
• Embedded Memory — Approximately 4.99 Mbits of on-chip RAM for data buffering, FIFOs and local storage without external memory.
• I/O Resources — 488 I/O pins support high-pin-count interfaces and dense board-level connectivity.
• Power — Voltage supply range from 860 mV to 1.15 V to meet specified core-power requirements.
• Package & Mounting — 780-BBGA (FCBGA) package; supplier device package listed as 780-FBGA (29 × 29) and designed for surface-mount assembly.
• Temperature & Grade — Industrial-grade device rated for operation from -40 °C to 100 °C.
• RoHS Compliance — Device is RoHS compliant for lead-free manufacturing processes.

Typical Applications

• High-density digital systems — Use the large logic element count and on-chip RAM to implement complex custom logic and state machines without immediate reliance on external devices.
• Multi-interface bridging — Leverage 488 I/O to connect and translate between numerous parallel and serial interfaces on a single FPGA package.
• Embedded data buffering — Approximately 4.99 Mbits of embedded memory supports local buffering and FIFO implementations for streaming data paths.

Unique Advantages

• Substantial logic capacity: 107,500 logic elements enable consolidation of multiple functions and reduce the need for external glue logic.
• Ample on-chip RAM: Approximately 4.99 Mbits of embedded memory minimizes dependence on external memory for many buffering and storage tasks.
• High I/O count: 488 I/O pins provide flexibility for complex board-level routing and multiple peripheral connections.
• Industrial temperature range: Rated from -40 °C to 100 °C for use in temperature-challenging environments.
• Compact FCBGA packaging: 780-ball BBGA footprint (780-FBGA, 29 × 29) offers high density in a surface-mount form factor.
• Manufacturer backing: Produced by Intel, providing continuity of supply and documented specifications.

Why Choose EP3SL110F780I4LN?

The EP3SL110F780I4LN combines a high logic element count, significant embedded memory and a very large I/O complement in a compact 780-BBGA FCBGA package. It is positioned for designs that demand integrated, high-density programmable logic and substantial local memory while operating across an industrial temperature range.

Engineers and procurement teams selecting this FPGA benefit from clear, verifiable specifications—logic capacity, on-chip RAM, I/O count, package details and operating conditions—that support scalable designs and predictable integration into board-level systems.

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