EP3SL150F1152C2

The EP3SL150F1152C2 is a Stratix® III L Field Programmable Gate Array (FPGA) IC from Intel, delivered in a 1152-BBGA FCBGA package. It provides a high logic capacity and substantial on-chip memory for designs that require dense programmable logic and large embedded RAM.

Key device attributes include 142,500 logic elements, approximately 6.54 Mbits of embedded memory, and 744 user I/Os, all in a surface-mount 1152-FBGA (35×35) footprint. The device operates over a 0.86 V to 1.15 V supply range and is specified for commercial temperature operation from 0 °C to 85 °C.

Key Features

• Core Logic  Contains 142,500 logic elements to implement complex digital functions and large-scale programmable logic designs.
• Embedded Memory  Includes approximately 6.54 Mbits of on-chip RAM for buffering, state storage, and memory-intensive algorithms.
• I/O and Packaging  Provides 744 device I/Os in a 1152-BBGA, FCBGA package; supplier package listed as 1152-FBGA (35×35) and intended for surface-mount PCB assembly.
• Power  Core supply range from 860 mV to 1.15 V to match system power domains and core voltage requirements.
• Temperature and Grade  Commercial grade device rated for operation from 0 °C to 85 °C.
• Compliance  RoHS compliant, suitable for lead-free production environments.

Typical Applications

• Complex digital processing  Use the device’s 142,500 logic elements and on-chip RAM to implement large-scale state machines, finite-state logic, and custom datapaths.
• High-pin-count interface bridging  744 I/Os enable dense protocol interfacing, bus bridging, and multi-channel I/O aggregation in a single FPGA package.
• Embedded memory-dependent functions  Approximately 6.54 Mbits of embedded memory supports buffering, lookup tables, and temporary data storage for algorithm acceleration.
• Compact board-level integration  1152-BBGA FCBGA package and surface-mount mounting facilitate high-density PCB layouts where board real estate is constrained.

Unique Advantages

• High logic density: 142,500 logic elements reduce the need for multiple discrete devices when implementing complex designs.
• Substantial on-chip memory: Approximately 6.54 Mbits of RAM enables memory-intensive processing without heavy reliance on external memory.
• Large I/O resource: 744 I/Os provide flexibility for multi-channel interfaces and parallel I/O requirements.
• Compact, high-pin-count package: 1152-BBGA (35×35) format balances high connectivity with a small board footprint for space-constrained designs.
• Commercial temperature range and RoHS compliance: Designed for standard commercial deployments and lead-free manufacturing flows.
• Wide core voltage compatibility: 0.86 V–1.15 V supply range accommodates common low-voltage FPGA core domains.

Why Choose EP3SL150F1152C2?

The EP3SL150F1152C2 positions itself as a high-capacity Stratix® III L FPGA option for engineers needing a combination of large logic resource, considerable embedded memory, and extensive I/O in a compact BGA package. Its specifications support designs that consolidate complex logic, heavy buffering, and numerous external interfaces onto a single programmable device.

With commercial temperature rating and RoHS compliance, the device is suited for mainstream electronic products and prototypes that require dense programmable logic and on-chip memory. The part is appropriate for teams focused on reducing board-level component count while maintaining flexible, reprogrammable hardware functionality.

Request a quote or submit an inquiry to get pricing and availability for the EP3SL150F1152C2.