EP3SL150F1152C2G

The EP3SL150F1152C2G is a high-density FPGA from Intel, built on the Stratix III device family architecture. It delivers a large logic fabric and embedded memory density suitable for high-performance logic, DSP, and embedded system designs where integration and I/O capacity matter.

Targeted at commercial applications, this surface-mount FCBGA device combines approximately 142,500 logic elements with approximately 6.54 Mbits of embedded memory and 744 user I/O pins, enabling complex combinational and sequential logic, memory buffering, and rich I/O interfacing in a single package.

Key Features

• Logic Capacity  Approximately 142,500 logic elements for large-scale logic integration and complex design implementation.
• Embedded Memory  Approximately 6.54 Mbits of on-chip memory to support FIFOs, buffering, and local data storage without external RAM.
• I/O and Banked Architecture  744 user I/O pins in a high-pin-count FBGA package, enabling broad peripheral connectivity and parallel interfaces.
• High-pin-count Package  1152-FBGA (35×35) package case (1152-BBGA/FCBGA), surface-mount mounting for dense board-level integration.
• Core Voltage Range  Core supply range from 0.860 V to 1.15 V to match system power requirements and performance targets.
• Commercial Temperature Grade  Operating temperature range of 0 °C to 85 °C for standard commercial environments.
• Stratix III Family Capabilities  Family-level features include DSP blocks for multiply-accumulate tasks, up to 12 PLLs, multi-clock support, dynamic on-chip termination, and optional 256-bit AES configuration security.
• Standards & Compliance  RoHS-compliant device suitable for environmentally regulated designs.

Typical Applications

• High-performance signal processing  Implement FIR filters, DSP pipelines, and custom arithmetic using the device's logic density and embedded memory.
• Networking and communications  Build protocol engines, packet processing, and interface bridging that leverage abundant I/O and family support for high-speed serial and parallel interfaces.
• Memory interface controllers  Implement custom controllers and buffering for external memory interfaces using on-chip RAM and flexible I/O.
• Embedded system integration  Integrate peripherals, custom accelerators, and soft processors for system-on-chip style designs in a single FPGA package.

Unique Advantages

• High integration density: Approximately 142,500 logic elements and 6.54 Mbits of embedded memory reduce the need for external components and simplify board-level BOM.
• Extensive I/O capability: 744 user I/O pins in a 1152-FBGA footprint provide ample connectivity for parallel buses, peripherals, and mixed-signal interfaces.
• Configurable power points: Core supply range of 0.860–1.15 V supports power/performance trade-offs and integration into diverse system power architectures.
• Commercial-grade reliability: Rated for 0 °C to 85 °C operation and RoHS compliant for mainstream commercial deployments.
• Stratix III family feature set: Access to family-level capabilities such as DSP blocks, PLLs, clocking resources, dynamic on-chip termination, and optional AES configuration security to accelerate system design.
• Surface-mount FBGA packaging: 1152-FBGA (35×35) package enables compact, high-pin-count board layouts for space-constrained systems.

Why Choose EP3SL150F1152C2G?

The EP3SL150F1152C2G is positioned for designers who require substantial logic resources, meaningful on-chip memory, and broad I/O in a commercial-grade FPGA. Its combination of approximately 142,500 logic elements, roughly 6.54 Mbits of embedded RAM, and 744 user I/Os provides a balanced platform for compute- and I/O-intensive designs.

Backed by the Stratix III family capabilities highlighted in the device handbook, this FPGA is suitable for engineers implementing high-performance DSP, protocol processing, custom memory interfaces, and integrated embedded systems where long-term scalability and a mature device feature set are important.

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