EP3SL150F1152C3N

The EP3SL150F1152C3N is a Stratix III L field programmable gate array (FPGA) from Intel, supplied in a 1152-ball FCBGA package. It delivers a high-density programmable fabric with 142,500 logic elements and extensive I/O capability for complex digital designs.

Built on the Stratix III architecture, the device integrates large on‑chip memory, DSP resources and advanced I/O and clocking structures described in the Stratix III device documentation, making it suitable for designs that require significant logic capacity, on‑chip RAM and high I/O density within a commercial-temperature range.

Key Features

• Logic Capacity — 142,500 logic elements to implement complex, high‑gate‑count designs.
• Embedded Memory — Approximately 6.54 Mbits of total on‑chip RAM for data buffering, FIFOs and local storage.
• I/O Density — 744 user I/Os to support wide parallel bus interfaces and numerous high‑speed links.
• Package and Mounting — 1152‑FBGA (35×35) FCBGA in a surface‑mount package for compact board integration.
• Power — Core supply range specified from 860 mV to 1.15 V to match system power rails.
• Operating Range and Grade — Commercial grade device rated for 0 °C to 85 °C operation.
• Family Architecture Features — Stratix III family features referenced in device documentation include TriMatrix embedded memory blocks, DSP blocks, clock networks and PLLs, high‑speed differential I/O support, external memory interface capability, JTAG boundary‑scan and design security features.
• Compliance — RoHS‑compliant for environmental conformance.

Typical Applications

• High‑performance data processing: Use the large logic capacity and on‑chip RAM for compute‑intensive FPGA implementations and data path acceleration.
• Signal processing and DSP: Leverage the Stratix III family’s DSP resources and embedded memory for filtering, transforms and real‑time processing tasks.
• Memory interface controllers: Implement external memory controllers and buffering using the device’s embedded RAM and dedicated I/O resources.
• High‑density I/O systems: Apply the 744 I/Os for multi‑lane interfaces, wide parallel buses or mixed control and data connectivity.

Unique Advantages

• High logic density: 142,500 logic elements enable consolidation of complex functions into a single FPGA, reducing board-level complexity.
• Substantial embedded memory: Approximately 6.54 Mbits of on‑chip RAM decreases external memory dependence and lowers latency for local buffering.
• Extensive I/O capability: 744 user I/Os support broad interfacing options and simplify routing of multi‑channel systems.
• Compact FCBGA packaging: The 1152‑FBGA (35×35) surface‑mount package supports high integration density on modern PCBs.
• Documented Stratix III architecture: Family features such as clock networks, PLLs, DSP blocks and external memory interfaces are documented in the Stratix III device handbook to guide system design.
• RoHS compliance and commercial grade: Environmentally compliant device rated for 0 °C to 85 °C operation for mainstream commercial applications.

Why Choose EP3SL150F1152C3N?

The EP3SL150F1152C3N positions itself as a high‑capacity Stratix III L FPGA option for engineers needing a large number of logic elements, significant on‑chip RAM and extensive I/O in a single surface‑mount package. Its documented family architecture and device capabilities make it appropriate for demanding digital signal processing, memory interfacing and high‑density I/O applications within commercial temperature environments.

Backed by Intel’s Stratix III device documentation, the part offers the design features and integration density required to consolidate complex subsystems, reduce BOM count, and support scalable implementations across a range of embedded and communications designs.

Request a quote or submit an inquiry to get pricing and availability information for the EP3SL150F1152C3N. Our team can provide technical details and assist with integration considerations for your design.