EP3SL150F1152C4LG

The EP3SL150F1152C4LG is a Stratix III family FPGA from Intel designed for high-performance logic, digital signal processing (DSP), and embedded system integration. This commercial-grade, surface-mount device combines high logic density, abundant embedded memory, and a large I/O count to support complex designs and demanding interface requirements.

Built around the Stratix III architecture, the device targets applications that require substantial on-chip resources, flexible power management, and advanced system-level features such as configurable clocks, PLLs, and security options offered across the family.

Key Features

• High Logic Density – 142,500 logic elements to implement complex state machines, control logic, and custom datapaths within a single device.
• Embedded Memory – Approximately 6.54 Mbits of on-chip RAM to support large buffers, FIFOs, and memory-centric functions without external memory dependency.
• Extensive I/O – 744 user I/Os to accommodate broad interface requirements and multiple parallel or high-pin-count external connections.
• Package and Mounting – 1152-ball FCBGA (1152-FBGA, 35×35) package in a surface-mount form factor for compact, high-density board designs.
• Core Voltage Range – Supply range from 860 mV to 1.15 V, enabling selectable core operating points for performance vs. power trade-offs.
• Commercial Temperature Grade – Rated for 0 °C to 85 °C operation suitable for commercial and enterprise applications.
• Family-Level Performance and Power Features – Stratix III family capabilities include Programmable Power Technology, selectable core voltage options, multiple PLLs and clock resources, and high-speed DSP blocks for multiplier and MAC implementations.
• Security and Reliability (Family) – Stratix III family supports optional 256-bit AES encryption for configuration bitstream protection and includes configuration memory error detection and correction features.
• Standards and Compliance – RoHS compliant for environmentally conscious manufacturing and assembly processes.

Typical Applications

• High-Performance DSP and Signal Processing – Use the device’s large logic element count and substantial on-chip RAM for FIR filters, FFTs, and other compute-heavy DSP pipelines.
• Network and Communications Systems – Large I/O count and family support for high-speed SERDES/communication standards make it suitable for protocol handling and packet processing functions.
• Custom ASIC Replacement and Prototyping – High logic density and embedded memory enable migration from custom ASICs or rapid hardware prototyping with extensive on-chip resources.
• Memory Interface Controllers – Dedicated memory features and I/O flexibility support design of DDR/DRAM interfaces and memory controller logic.

Unique Advantages

• Substantial On-Chip Resources: 142,500 logic elements and approximately 6.54 Mbits of embedded memory reduce dependence on external components and simplify board design.
• Flexible I/O Capacity: 744 user I/Os enable diverse interface topologies and support for multiple parallel buses or many single-ended/differential channels.
• Power and Performance Trade-offs: Core voltage range (860 mV–1.15 V) and family Programmable Power Technology allow designers to tune performance versus power consumption.
• Commercial-Grade Reliability: Rated for 0 °C–85 °C operation with on-chip reliability features (as provided by the Stratix III family) for robust system operation in commercial environments.
• Security and Error Detection: Family support for 256-bit AES configuration encryption and configuration memory error detection helps protect IP and improve system availability.
• Compact, High-Density Package: 1152-ball FCBGA (35×35) provides a high-pin-count solution in a space-efficient form factor for dense PCB layouts.

Why Choose EP3SL150F1152C4LG?

The EP3SL150F1152C4LG positions itself as a high-capacity, commercially graded FPGA for designs that demand substantial logic, memory, and I/O integration in a single device. Its combination of 142,500 logic elements, roughly 6.54 Mbits of embedded RAM, and 744 I/Os makes it suitable for complex DSP tasks, high-throughput interfacing, and advanced prototyping where board area and component count must be minimized.

As part of the Stratix III family from Intel, this FPGA benefits from family-level features such as selectable core voltage, power optimization techniques, clocking and PLL resources, and configuration security options—providing a scalable platform for engineers and procurement teams focused on performance, integration, and long-term design flexibility.

Request a quote or submit a procurement inquiry for EP3SL150F1152C4LG to discuss availability, lead times, and volume pricing.