EP3SL150F1152I3

The EP3SL150F1152I3 is a Stratix® III L field programmable gate array (FPGA) from Intel, supplied in a 1152‑ball BGA (FCBGA) package. It delivers a large logic fabric, substantial embedded memory, and a high I/O count in an industrial‑grade, surface‑mount package for demanding embedded and industrial applications.

Key Features

• Logic Capacity  142,500 logic elements provide a broad programmable fabric for implementing complex digital functions and custom logic.
• Embedded Memory  Approximately 6.54 Mbits of on‑chip RAM for buffering, buffering, and local data storage to support intermediate data processing and state retention.
• I/O Density  744 user I/O pins enable connectivity to a wide range of peripherals, sensors, and high‑density interface requirements.
• Power Supply  Core supply range of 860 mV to 1.15 V to match system power architectures and control power budgeting at the FPGA core.
• Package & Mounting  1152‑BBGA, FCBGA package (supplier device package: 1152‑FBGA, 35×35) designed for surface‑mount PCB assembly and compact board layouts.
• Industrial Temperature Range  Rated for operation from −40 °C to 100 °C to meet extended temperature requirements for industrial environments.
• RoHS Compliance  Device is RoHS compliant.

Typical Applications

• Industrial Control  Implement motor control logic, real‑time processing, and I/O aggregation where extended temperature range and industrial grading are needed.
• Embedded Systems  Integrate custom digital functions and local memory buffering in compact embedded platforms requiring high logic density and many I/O connections.
• Communications and Networking  Support protocol handling, packet buffering, and interface bridging using the device’s large logic array and substantial on‑chip RAM.
• High‑Density I/O Systems  Manage large numbers of peripheral signals or sensor inputs leveraging 744 available I/O pins for flexible interfacing.

Unique Advantages

• High Logic Capacity: 142,500 logic elements enable implementation of sizable, complex logic designs without immediate migration to a larger device family.
• Substantial On‑Chip Memory: Approximately 6.54 Mbits of embedded RAM reduces external memory requirements for many buffering and state‑storage tasks.
• Large I/O Count: 744 I/O pins simplify board design when connecting multiple peripherals, interfaces, or sensor arrays.
• Industrial‑Grade Operation: Specified operation from −40 °C to 100 °C supports deployment in temperature‑challenging industrial environments.
• Compact BGA Packaging: 1152‑ball FCBGA (35×35) delivers a high pin count in a compact footprint suited to space‑constrained PCB designs.

Why Choose EP3SL150F1152I3?

The EP3SL150F1152I3 combines a large programmable logic fabric, meaningful on‑chip RAM, and a very high I/O count within an industrial‑rated package, making it well suited for designers who need substantial integration and reliable operation across extended temperatures. Its 1152‑ball FCBGA package supports dense board integration while the specified core voltage range allows alignment with low‑voltage system architectures.

This FPGA is a practical choice for engineering teams implementing complex digital functions, high‑density interfacing, and embedded buffering where industrial temperature capability and RoHS compliance are required.

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