EP3SL150F1152I4G

IC FPGA 744 I/O 1152FBGA
Part Description

Field Programmable Gate Array (FPGA) IC

Quantity 1,383 Available (as of October 7, 2026)
Product CategoryField Programmable Gate Array (FPGA)
ManufacturerIntel
Manufacturing StatusActive
Manufacturer Standard Lead Time26 Weeks
Datasheet

Specifications & Environmental

Device Package1152-FBGA (35x35)GradeIndustrialOperating Temperature-40°C – 100°C
Package / Case1152-BBGA, FCBGANumber of I/O744Voltage860 mV - 1.15 V
Mounting MethodSurface MountRoHS ComplianceRoHS CompliantREACH ComplianceREACH Unaffected
Moisture Sensitivity Level3 (168 Hours)Number of LABs/CLBs5700Number of Logic Elements/Cells142500
Number of GatesN/AECCNN/AHTS CodeN/A
QualificationN/ATotal RAM Bits6543360

Overview of EP3SL150F1152I4G – Field Programmable Gate Array (FPGA) IC

The EP3SL150F1152I4G is a Stratix III family FPGA from Intel designed for high-performance logic, DSP, and embedded system applications. Built on a 65-nm all-layer copper SRAM process, the device combines large programmable logic capacity with on-chip memory and advanced I/O to support demanding system integration.

With 142,500 logic elements, approximately 6.54 Mbits of embedded memory and 744 user I/Os in a 1152-ball FBGA package, this industrial-grade, surface-mount FPGA is targeted at applications that require scalable performance, configurable I/O, and configurable power/clocking resources.

Key Features

  • Core Logic — 142,500 logic elements providing extensive programmable logic capacity for complex designs.
  • Embedded Memory — approximately 6.54 Mbits of on-chip RAM to support large buffering, packet processing, and data-path implementations.
  • I/O and Package — 744 user I/Os in a 1152-BBGA / 1152-FBGA (35×35) package, enabling dense connectivity and high-pin-count system designs.
  • Power — Core voltage range 0.86 V to 1.15 V with Stratix III programmable power technology and selectable core voltage options to balance performance and power consumption.
  • Temperature & Grade — Industrial grade with an operating temperature range of −40 °C to 100 °C; RoHS compliant and designed for surface-mount assembly.
  • Clocking and Clock Management — Series-level capabilities include multiple global and regional clocks and up to 12 PLLs for flexible clock synthesis and dynamic phase control.
  • DSP and Math Blocks — Stratix III architecture provides high-speed dedicated DSP multiplier blocks and multiply-accumulate resources suitable for signal processing workloads.
  • High-Speed I/O — Series-level support for SERDES with dynamic phase alignment and high-speed differential I/O, enabling multi-gigabit and memory interface connectivity.
  • Security & Reliability — Series-level features include optional 256-bit AES encryption for configuration bitstream protection, CRC-based configuration error detection, and ECC for embedded memory blocks.

Typical Applications

  • High-Performance Networking — Packet processing, switching, and protocol bridging where large logic capacity and high-speed I/O are required.
  • Digital Signal Processing — Implementation of FIR filters, multipliers, and other DSP functions using the device’s dedicated DSP blocks and on-chip memory.
  • Memory Interface and Controllers — Front-end controllers and memory interface logic leveraging abundant embedded RAM and flexible I/O resources.
  • Embedded Systems and Accelerators — Custom accelerators and embedded logic functions that benefit from large logic density and selectable core voltage for power/performance trade-offs.

Unique Advantages

  • High Logic Density: 142,500 logic elements provide headroom for complex state machines, wide datapaths, and large control logic blocks, reducing the need for multiple devices.
  • Significant On-Chip Memory: Approximately 6.54 Mbits of embedded RAM supports deep buffering and in-line data manipulation without external memory dependency.
  • Flexible Power Management: Selectable core voltage and programmable power technology let designers tune for higher performance or lower power as system needs change.
  • Robust Industrial Operating Range: −40 °C to 100 °C rating and RoHS compliance make the device suitable for industrial environments and standard manufacturing flows.
  • Comprehensive System Features: Integrated clock management, DSP resources, and optional security and error-detection features help simplify system design and improve reliability.

Why Choose EP3SL150F1152I4G?

The EP3SL150F1152I4G delivers a balance of large programmable logic capacity, substantial embedded memory, and flexible I/O in a single industrial-grade FPGA package. It is positioned for designs that demand scalable logic resources, controlled power/performance trade-offs, and robust system-level features drawn from the Stratix III device family.

This device is well suited to engineers building high-throughput network equipment, DSP-heavy subsystems, and embedded accelerators who require a proven FPGA architecture with selectable core voltage, advanced clocking, and on-chip security and reliability mechanisms.

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