EP3SL150F1152I4G
| Part Description |
Field Programmable Gate Array (FPGA) IC |
|---|---|
| Quantity | 1,383 Available (as of October 7, 2026) |
| Product Category | Field Programmable Gate Array (FPGA) |
|---|---|
| Manufacturer | Intel |
| Manufacturing Status | Active |
| Manufacturer Standard Lead Time | 26 Weeks |
| Datasheet |
Specifications & Environmental
| Device Package | 1152-FBGA (35x35) | Grade | Industrial | Operating Temperature | -40°C – 100°C | ||
|---|---|---|---|---|---|---|---|
| Package / Case | 1152-BBGA, FCBGA | Number of I/O | 744 | Voltage | 860 mV - 1.15 V | ||
| Mounting Method | Surface Mount | RoHS Compliance | RoHS Compliant | REACH Compliance | REACH Unaffected | ||
| Moisture Sensitivity Level | 3 (168 Hours) | Number of LABs/CLBs | 5700 | Number of Logic Elements/Cells | 142500 | ||
| Number of Gates | N/A | ECCN | N/A | HTS Code | N/A | ||
| Qualification | N/A | Total RAM Bits | 6543360 |
Overview of EP3SL150F1152I4G – Field Programmable Gate Array (FPGA) IC
The EP3SL150F1152I4G is a Stratix III family FPGA from Intel designed for high-performance logic, DSP, and embedded system applications. Built on a 65-nm all-layer copper SRAM process, the device combines large programmable logic capacity with on-chip memory and advanced I/O to support demanding system integration.
With 142,500 logic elements, approximately 6.54 Mbits of embedded memory and 744 user I/Os in a 1152-ball FBGA package, this industrial-grade, surface-mount FPGA is targeted at applications that require scalable performance, configurable I/O, and configurable power/clocking resources.
Key Features
- Core Logic — 142,500 logic elements providing extensive programmable logic capacity for complex designs.
- Embedded Memory — approximately 6.54 Mbits of on-chip RAM to support large buffering, packet processing, and data-path implementations.
- I/O and Package — 744 user I/Os in a 1152-BBGA / 1152-FBGA (35×35) package, enabling dense connectivity and high-pin-count system designs.
- Power — Core voltage range 0.86 V to 1.15 V with Stratix III programmable power technology and selectable core voltage options to balance performance and power consumption.
- Temperature & Grade — Industrial grade with an operating temperature range of −40 °C to 100 °C; RoHS compliant and designed for surface-mount assembly.
- Clocking and Clock Management — Series-level capabilities include multiple global and regional clocks and up to 12 PLLs for flexible clock synthesis and dynamic phase control.
- DSP and Math Blocks — Stratix III architecture provides high-speed dedicated DSP multiplier blocks and multiply-accumulate resources suitable for signal processing workloads.
- High-Speed I/O — Series-level support for SERDES with dynamic phase alignment and high-speed differential I/O, enabling multi-gigabit and memory interface connectivity.
- Security & Reliability — Series-level features include optional 256-bit AES encryption for configuration bitstream protection, CRC-based configuration error detection, and ECC for embedded memory blocks.
Typical Applications
- High-Performance Networking — Packet processing, switching, and protocol bridging where large logic capacity and high-speed I/O are required.
- Digital Signal Processing — Implementation of FIR filters, multipliers, and other DSP functions using the device’s dedicated DSP blocks and on-chip memory.
- Memory Interface and Controllers — Front-end controllers and memory interface logic leveraging abundant embedded RAM and flexible I/O resources.
- Embedded Systems and Accelerators — Custom accelerators and embedded logic functions that benefit from large logic density and selectable core voltage for power/performance trade-offs.
Unique Advantages
- High Logic Density: 142,500 logic elements provide headroom for complex state machines, wide datapaths, and large control logic blocks, reducing the need for multiple devices.
- Significant On-Chip Memory: Approximately 6.54 Mbits of embedded RAM supports deep buffering and in-line data manipulation without external memory dependency.
- Flexible Power Management: Selectable core voltage and programmable power technology let designers tune for higher performance or lower power as system needs change.
- Robust Industrial Operating Range: −40 °C to 100 °C rating and RoHS compliance make the device suitable for industrial environments and standard manufacturing flows.
- Comprehensive System Features: Integrated clock management, DSP resources, and optional security and error-detection features help simplify system design and improve reliability.
Why Choose EP3SL150F1152I4G?
The EP3SL150F1152I4G delivers a balance of large programmable logic capacity, substantial embedded memory, and flexible I/O in a single industrial-grade FPGA package. It is positioned for designs that demand scalable logic resources, controlled power/performance trade-offs, and robust system-level features drawn from the Stratix III device family.
This device is well suited to engineers building high-throughput network equipment, DSP-heavy subsystems, and embedded accelerators who require a proven FPGA architecture with selectable core voltage, advanced clocking, and on-chip security and reliability mechanisms.
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