EP3SL150F1152I4LN

The EP3SL150F1152I4LN is a Stratix® III L field programmable gate array (FPGA) from Intel, supplied in a 1152-ball BGA/FCBGA package with a 35×35 mm footprint. Designed for industrial applications, this device combines a large logic capacity with substantial on-chip memory and extensive I/O to support complex, high-density digital designs.

Key on-chip resources include approximately 142,500 logic elements, roughly 6.54 Mbits of embedded memory, and 744 I/O pins. The device operates from 0.86 V to 1.15 V and supports an operating temperature range from −40 °C to 100 °C, making it suitable for demanding environments.

Key Features

• Logic Capacity  Approximately 142,500 logic elements providing substantial programmable logic resources for complex digital functions and system integration.
• Embedded Memory  Approximately 6.54 Mbits of on-chip RAM to support buffering, packet processing, and other memory-intensive logic tasks.
• I/O Count  744 general-purpose I/O pins to accommodate high-density interconnect requirements and multiple peripheral interfaces.
• Power Supply  Operates across a core voltage range of 0.86 V to 1.15 V to match system power architectures.
• Package & Mounting  1152-ball BGA (FCBGA) surface-mount package; supplier device package listed as 1152-FBGA (35×35 mm) for compact, high-pin-count board designs.
• Industrial Temperature Range  Rated for −40 °C to 100 °C operation, suitable for industrial temperature environments.
• Regulatory Compliance  RoHS compliant for reduced hazardous substances in manufacturing.

Typical Applications

• Industrial Control and Automation  High logic density and wide operating temperature make this FPGA suitable for consolidating control algorithms, motor control interfaces, and deterministic I/O handling in industrial systems.
• High-Density I/O Systems  With 744 I/O pins, the device supports systems requiring many external interfaces, expanders, or parallel data lanes.
• Embedded Processing and Acceleration  Large logic element count and substantial on-chip RAM enable implementation of custom accelerators, protocol offload, and data-path processing.

Unique Advantages

• High Integration:  Large logic and memory resources allow multiple functions to be implemented in a single device, reducing board-level component count.
• Scalable I/O Capacity:  744 I/O pins provide flexibility to connect to many peripherals and external devices without additional multiplexing hardware.
• Industrial Reliability:  Rated operation from −40 °C to 100 °C supports deployment in temperature-demanding industrial environments.
• Compact High-Pin Package:  1152-ball FCBGA (35×35 mm) package delivers high pin density in a compact footprint for space-constrained designs.
• RoHS Compliant:  Helps meet regulatory requirements for reduced hazardous substances in manufacturing and assembly.

Why Choose EP3SL150F1152I4LN?

The EP3SL150F1152I4LN combines substantial programmable logic resources, significant on-chip memory, and very high I/O density in a compact FCBGA package, positioning it for industrial and high-density embedded applications that require consolidation of complex digital functions. Its voltage and temperature specifications align with industrial system architectures, offering designers predictable electrical and environmental behavior.

This FPGA is well suited to engineering teams seeking a scalable, high-capacity device for custom logic, data processing, and multi-interface designs where integration, I/O count, and on-chip memory are key selection criteria.

Request a quote or submit a pricing inquiry for the EP3SL150F1152I4LN to receive availability and ordering information tailored to your project requirements.