EP3SL150F780C2

The EP3SL150F780C2 is a Stratix® III L Field Programmable Gate Array (FPGA) from Intel, supplied in a 780-ball FCBGA surface-mount package. It combines high logic density and substantial embedded memory with a large I/O count to address complex digital designs.

With 142,500 logic elements, approximately 6.54 Mbits of on-chip RAM and 488 user I/Os, this commercial-grade FPGA is suited for applications that require significant programmable logic, embedded memory and dense I/O in a compact BGA footprint. The device operates from a core supply of 0.86 V to 1.15 V and is specified for 0 °C to 85 °C operation.

Key Features

• Logic Capacity — 142,500 logic elements provide substantial programmable fabric for complex combinational and sequential functions.
• Embedded Memory — Approximately 6.54 Mbits of on-chip RAM available for buffers, FIFOs and local data storage.
• I/O Resources — 488 user I/Os to support broad peripheral, bus and high-pin-count interfacing requirements.
• Power — Core voltage operation from 860 mV to 1.15 V to match system power domains and enable standard FPGA power architectures.
• Package & Mounting — 780-ball BGA, FCBGA (29 × 29) surface-mount package for compact, high-density board designs.
• Commercial Temperature Range — Rated for 0 °C to 85 °C operation for general-purpose and consumer-facing applications.
• RoHS Compliant — Meets RoHS requirements for lead-free manufacturing processes.

Typical Applications

• Data and Signal Processing — Use the large logic array and embedded RAM to implement custom processing pipelines, buffering and protocol handling.
• High-Density I/O Systems — 488 I/Os support complex board-level interfacing, parallel buses and multiple peripheral connections.
• Prototyping and Custom Hardware — High logic capacity and a compact BGA package make it suitable for prototype boards and proof-of-concept hardware platforms.

Unique Advantages

• High Logic Density: 142,500 logic elements enable consolidation of multiple functions into a single device, reducing component count and board complexity.
• Significant On-Chip Memory: Approximately 6.54 Mbits of embedded RAM supports local buffering and fast data paths without external memory.
• Large I/O Count: 488 user I/Os allow flexible interfacing and support for multiple external subsystems without additional expansion components.
• Compact BGA Packaging: 780-ball FCBGA (29×29) provides dense routing and a small PCB footprint for space-constrained designs.
• Commercial Grade: Specified operation from 0 °C to 85 °C for mainstream electronics and consumer applications.
• RoHS Compliant: Compliant with lead-free manufacturing requirements to support modern assembly processes.

Why Choose EP3SL150F780C2?

The EP3SL150F780C2 positions itself as a capable, commercially rated Stratix® III L FPGA for designs that require a large number of logic elements, substantial embedded memory and a high I/O count in a compact surface-mount BGA package. Its combination of resources and packaging supports consolidation of complex digital functions onto a single programmable device.

This part is suited to engineers and procurement teams seeking a high-density, RoHS-compliant FPGA for data processing, I/O-intensive, and prototype hardware applications where on-chip memory and broad interfacing matter. The device’s supply voltage and temperature range enable integration into standard commercial electronic systems.

Request a quote today to discuss pricing, availability and lead times for the EP3SL150F780C2.