EP3SL150F1152I4N

The EP3SL150F1152I4N is an Intel Stratix® III L FPGA in a 1152-BBGA (1152-FBGA, 35×35) surface-mount package. It provides a large logic fabric of 142,500 logic elements, approximately 6.54 Mbits of embedded RAM, and 744 I/O pins, combined with an industrial operating temperature range and RoHS compliance.

This device targets designs that require high logic density, substantial on-chip memory, and broad I/O connectivity while meeting industrial temperature and environmental requirements.

Key Features

• Core Logic 142,500 logic elements for implementing complex digital functions on a single device.
• Embedded Memory Approximately 6.54 Mbits of on-chip RAM to support buffering, packet processing, and intermediate storage without relying solely on external memory.
• I/O Capacity 744 user I/O pins to support extensive external interfaces and parallel connectivity.
• Package & Mounting 1152-BBGA (1152-FBGA, 35×35) surface-mount package for compact board-level integration.
• Power Core voltage supply range of 860 mV to 1.15 V for defined power domain planning.
• Temperature & Grade Industrial grade device with an operating temperature range of −40 °C to 100 °C.
• Environmental Compliance RoHS compliant to meet common environmental and manufacturing requirements.

Unique Advantages

• High logic integration: 142,500 logic elements enable consolidation of complex functions into a single FPGA, reducing board-level component count.
• Significant on-chip RAM: Approximately 6.54 Mbits of embedded memory helps minimize external memory dependencies and simplifies memory architecture.
• Extensive connectivity: 744 I/Os provide flexibility for multiple buses, peripherals, and parallel interfaces without additional I/O expanders.
• Industrial robustness: Industrial grade rating and −40 °C to 100 °C operating range support deployment in demanding temperature environments.
• Compact system integration: 1152-FBGA (35×35) surface-mount package enables dense board layouts for space-constrained applications.
• Regulatory alignment: RoHS compliance supports environmentally conscious manufacturing and supply-chain requirements.

Why Choose EP3SL150F1152I4N?

The EP3SL150F1152I4N combines large logic capacity, substantial embedded memory, and extensive I/O in an industrial-grade Stratix® III L FPGA package. Its defined voltage range and BGA footprint make it suitable for designs that prioritize on-chip resources, board-level integration, and operation across wide temperature ranges.

This device is well suited for engineers and procurement teams seeking a high-density FPGA solution that balances logic, memory, and I/O while adhering to RoHS and industrial temperature requirements.

If you would like pricing or availability information, request a quote or submit an inquiry to receive a formal quote and lead-time details.