EP3SL150F1152I4LG

The EP3SL150F1152I4LG is a Stratix III family FPGA optimized for high-performance, embedded logic and memory applications. With 142,500 logic elements and approximately 6.54 Mbits of embedded memory, this industrial-grade, surface-mount FCBGA device targets compute- and I/O-intensive systems that require dense logic, significant on-chip memory, and flexible power options.

Designed for applications that demand scalable logic density, abundant I/O, and robust operation across a wide temperature range, this device delivers an architecture-level feature set from the Stratix III family including selectable core voltage and on-chip reliability features documented in the device handbook.

Key Features

• Logic Capacity  142,500 logic elements for implementing large-scale logic, control and custom processing functions.
• Embedded Memory  Approximately 6.54 Mbits of on-chip RAM to support buffers, FIFOs and data storage close to logic.
• I/O Density  744 user I/O pins to support wide peripheral connectivity and multiple parallel interfaces.
• Package & Mounting  1152-BBGA (1152-FBGA, 35×35) package in a surface-mount form factor for compact board integration.
• Voltage Range  Core supply from 860 mV to 1.15 V, enabling selectable core-voltage operation documented for the Stratix III family.
• Operating Temperature  Industrial-grade operation from −40 °C to 100 °C for deployment in demanding environments.
• Family-Level Capabilities  Stratix III family features such as selectable core voltage, integrated PLLs, multiple clock resources, and programmable power technology (as described in the device handbook).
• Reliability & Security  Family-level support for configuration memory error detection and optional AES-based configuration-key security described in the Stratix III device documentation.
• RoHS Compliant  Meets RoHS requirements for lead-free, compliant assembly and manufacturing.

Typical Applications

• High-performance signal processing  Implement DSP pipelines, filters and custom arithmetic logic using the device’s large logic count and embedded memory.
• Network and communications interfaces  Leverage high I/O density to bridge multiple serial and parallel interfaces in communications equipment and line cards.
• Memory controller and buffering  Use on-chip RAM and programmable logic to implement memory interfaces, buffering and protocol translation tasks.
• Industrial control systems  Industrial-grade temperature range and robust packaging enable deployment in factory automation, motor control and test equipment.

Unique Advantages

• High logic and memory density: 142,500 logic elements combined with approximately 6.54 Mbits of embedded memory reduces the need for external logic and RAM, simplifying board-level design.
• Substantial I/O count: 744 user I/Os enable direct connections to multiple peripherals and parallel interfaces without extensive multiplexing.
• Industrial temperature rating: Rated from −40 °C to 100 °C for reliable operation in demanding installations and extended-environment applications.
• Flexible packaging: 1152-FBGA (35×35) package supports high-pin-count routing and compact PCB layouts for space-constrained systems.
• Power configurability: Core voltage support from 0.86 V to 1.15 V enables trade-offs between performance and power consistent with Stratix III selectable core-voltage capability.
• Standards-compliant supply chain readiness: RoHS compliance supports modern manufacturing and regulatory requirements.

Why Choose EP3SL150F1152I4LG?

This Stratix III FPGA part delivers a combination of substantial logic capacity, embedded memory and high I/O count packaged for industrial environments. It is well suited to designs that require integrated buffering, large-scale custom logic and flexible power/clocking options described in the Stratix III device family documentation.

Choose EP3SL150F1152I4LG when your design requires a high-density, industrial-grade FPGA with extensive on-chip resources and family-level features for security, clocking and power configurability to support long-term product scalability and robust system integration.

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