EP3SL150F1152I3N

The EP3SL150F1152I3N is a Stratix® III L Field Programmable Gate Array (FPGA) from Intel supplied in a 1152‑BBGA FCBGA package. It delivers a large logic footprint, high I/O count and embedded memory capacity targeted for demanding industrial applications.

With 142,500 logic elements, approximately 6.54 Mbits of on‑chip RAM and 744 I/Os, this device is suited to designs that require substantial programmable logic, high connectivity and operation across an extended industrial temperature range.

Key Features

• Core Capacity Approximately 142,500 logic elements for implementing complex digital functions and large-scale logic designs.
• Embedded Memory Approximately 6.54 Mbits of on‑chip RAM to support buffering, state storage and memory‑intensive logic blocks.
• I/O Density 744 programmable I/Os to support high channel counts, broad interface options and dense board-level interconnect.
• Power Supply Core voltage range from 860 mV to 1.15 V, enabling compatibility with typical FPGA core supply rails.
• Package and Mounting 1152‑BBGA FCBGA package (supplier package: 1152‑FBGA, 35×35) designed for surface mount assembly and compact board integration.
• Industrial Temperature Range Rated for operation from −40 °C to 100 °C to meet extended temperature requirements in industrial environments.
• Regulatory Compliance RoHS compliant to support environmentally conscious designs and regulatory requirements.

Typical Applications

• High‑density digital systems — Implement large, custom digital pipelines and control logic using the device's substantial logic element count and embedded memory.
• Industrial automation — Use the extended −40 °C to 100 °C operating range and high I/O count for sensor interfacing, motion control and machine control systems.
• Data acquisition and switching — Leverage 744 I/Os and on‑chip RAM for high-channel data capture, protocol bridging and packet buffering.
• Prototyping and system integration — Deploy as a platform for validating complex algorithms and consolidating multiple functions into a single FPGA package.

Unique Advantages

• High logical capacity: Approximately 142,500 logic elements enable implementation of large-scale custom logic without immediate need for multiple devices.
• Significant on‑chip memory: Approximately 6.54 Mbits of embedded RAM supports buffering and stateful functions directly on the FPGA fabric.
• Exceptional I/O connectivity: 744 I/Os provide flexibility to connect numerous peripherals, sensors and high-channel interfaces on a single device.
• Industrial suitability: Operation from −40 °C to 100 °C and RoHS compliance make the device appropriate for temperature‑challenging, regulatory‑conscious deployments.
• Compact surface‑mount package: 1152‑BBGA/1152‑FBGA (35×35) package supports dense PCB layouts and integration into space-constrained systems.

Why Choose EP3SL150F1152I3N?

The EP3SL150F1152I3N combines a large programmable fabric, substantial embedded memory and one of the highest I/O counts in its package class to address complex, connectivity‑intensive designs. Its industrial temperature rating and surface‑mount 1152‑BBGA package make it a practical choice for robust, compact systems that require extended environmental performance.

This part is well suited to engineers and teams building high‑logic, high‑I/O solutions that benefit from on‑chip memory and a compact form factor, offering long‑term design scalability within the Stratix® III L family.

Request a quote or submit a purchase inquiry to check pricing and availability for EP3SL150F1152I3N.