EP3SL150F1152I4L

The EP3SL150F1152I4L is a Stratix® III L Field Programmable Gate Array (FPGA) IC from Intel, delivered in a high-density 1152-ball FCBGA package. It provides a combination of large logic capacity, on-chip RAM, and a high I/O count for complex digital designs.

This device is suitable for industrial applications that require substantial programmable logic resources, embedded memory, and flexible I/O connectivity within a surface-mount, ball-grid package.

Key Features

• Core Logic Density — 142,500 logic elements and 5,700 logic blocks provide substantial fabric capacity for complex, multi-functional designs.
• Embedded Memory — Approximately 6.54 Mbits of on-chip RAM to support buffering, FIFOs, and data-path storage without external memory.
• I/O Capability — 744 I/O pins to accommodate wide parallel interfaces, multi-channel connectivity, and diverse peripheral integration.
• Power Supply — Operates from a VCC range of 860 mV to 1.15 V, enabling designs that target the device’s specified core voltage window.
• Package and Mounting — 1152-BBGA (FCBGA) package, supplier device package 1152-FBGA (35×35), optimized for surface-mount PCB assembly.
• Industrial Temperature Range — Rated for operation from −40 °C to 100 °C to meet industrial-environment requirements.
• Regulatory Compliance — RoHS compliant, supporting lead-free manufacturing processes.

Typical Applications

• Signal Processing and Acceleration — Use the large logic and embedded RAM for DSP kernels, packet processing, and custom accelerator blocks that require on-chip resources.
• High‑Density I/O Systems — Leverage 744 I/Os for multi-channel interfaces, parallel sensor arrays, or board-level bridging between subsystems.
• Industrial Control and Automation — The device’s logic capacity and industrial temperature rating support control logic, timing, and interface aggregation in industrial equipment.
• Prototyping and System Integration — Combine abundant logic elements and memory to prototype complex SoC functions or integrate multiple functions onto a single FPGA.

Unique Advantages

• High logic and block count: 142,500 logic elements and 5,700 logic blocks enable integration of large digital systems on a single device, reducing board-level complexity.
• Substantial on-chip RAM: Approximately 6.54 Mbits of embedded memory minimizes reliance on external DRAM for many buffering and storage tasks.
• Extensive I/O resources: 744 I/Os provide flexibility to support wide interfaces and multiple peripherals without additional interface logic.
• Robust operating range: Industrial temperature rating (−40 °C to 100 °C) matches demanding environmental needs for industrial deployments.
• Compact ball-grid package: 1152-BBGA (35×35) FCBGA package allows high-density PCB routing and efficient surface-mount assembly.
• RoHS compliant: Supports modern, lead-free manufacturing and environmental compliance requirements.

Why Choose EP3SL150F1152I4L?

The EP3SL150F1152I4L positions itself as a high-density Stratix® III L FPGA option for engineers needing significant logic capacity, embedded memory, and a large I/O footprint in a surface-mount FCBGA package. Its combination of 142,500 logic elements, approximately 6.54 Mbits of RAM, and 744 I/Os makes it well suited for complex digital processing, high-channel-count interfaces, and integrated system designs in industrial environments.

For teams targeting scalable, hardware-accelerated functions with the reliability demanded by industrial designs, this Intel FPGA delivers the core resources and operating range required to consolidate functionality and simplify board-level integration.

Request a quote or submit a pricing inquiry today to get availability and ordering information for the EP3SL150F1152I4L.