EP3SL150F1152I4

The EP3SL150F1152I4 is a Stratix® III L field programmable gate array (FPGA) from Intel, supplied in a 1152-BBGA FCBGA package. It delivers a large programmable fabric with substantial embedded memory and a high I/O count for complex digital designs.

Designed for industrial-grade applications, this device combines 142,500 logic elements with approximately 6.54 Mbits of on-chip RAM, and supports a wide operating temperature range and RoHS compliance to help meet demanding system requirements.

Key Features

• Core Logic — 142,500 logic elements to implement sizable custom logic, state machines, and datapath functions.
• Embedded Memory — Approximately 6.54 Mbits of on-chip RAM for buffering, look-up tables, and intermediate data storage.
• I/O Capacity — Up to 744 I/Os to support dense connectivity to peripherals, interfaces, and external devices.
• Power Supply Range — Operates from 0.86 V to 1.15 V supply rails, enabling compatibility with targeted system power architectures.
• Package & Mounting — 1152-BBGA (FCBGA) package, supplier device package 1152-FBGA (35×35), intended for surface-mount PCB assembly.
• Industrial Temperature Rating — Specified operating range from −40°C to 100°C for use in industrial environments.
• Compliance — RoHS compliant to align with environmental and manufacturing requirements.

Typical Applications

• Industrial Control — Implement complex control logic and machine automation functions that require extensive programmable logic and reliable operation across −40°C to 100°C.
• Communications & Networking — Realize protocol processing and interface bridging with large logic resources and abundant I/O for packet handling and data path designs.
• Test & Measurement Systems — Provide flexible real-time signal processing, data aggregation, and custom instrumentation logic leveraging on-chip RAM and high I/O density.

Unique Advantages

• Substantial Logic Density: 142,500 logic elements enable implementation of complex state machines, datapaths, and custom accelerators without external logic.
• Significant On-Chip Memory: Approximately 6.54 Mbits of embedded RAM reduces dependence on external memory for buffering and lookup operations.
• High I/O Count: Up to 744 I/Os support dense peripheral connectivity and multi-channel interfacing on compact boards.
• Industrial Ready: Rated for −40°C to 100°C operation and supplied in a surface-mount FCBGA package suitable for industrial system assemblies.
• RoHS Compliant: Meets environmental compliance expectations for modern manufacturing and deployment.

Why Choose EP3SL150F1152I4?

The EP3SL150F1152I4 positions itself where substantial programmable resources and industrial reliability are required. With 142,500 logic elements, approximately 6.54 Mbits of embedded RAM, and up to 744 I/Os, it supports complex logic, memory-intensive functions, and dense connectivity within a surface-mount FCBGA form factor.

Manufactured by Intel and offered with industrial temperature and RoHS compliance, this FPGA is suitable for engineers and OEMs building robust, scalable designs that demand large programmable capacity and reliable operation in industrial settings.

Request a quote or submit an inquiry to receive pricing and availability information for the EP3SL150F1152I4.