EP3SL150F1152C4N

The EP3SL150F1152C4N is a Stratix® III L field programmable gate array (FPGA) in a 1152‑ball BGA (FCBGA) package designed for commercial applications. It integrates a high logic density fabric with extensive embedded memory and a large I/O count to support complex digital systems.

With 142,500 logic elements, approximately 6.54 Mbits of on‑chip RAM and 744 I/O pins, this device is suited to designs requiring significant logic resources, substantial embedded memory, and wide external connectivity within a surface‑mount 1152‑FBGA (35×35) package. Supply voltage ranges from 0.86 V to 1.15 V and the device is specified for commercial operating temperatures (0 °C to 85 °C).

Key Features

• Core Logic Density — 142,500 logic elements provide substantial programmable fabric for implementating complex digital logic and custom datapaths.
• Embedded Memory — Approximately 6.54 Mbits of on‑chip RAM for buffering, packet storage, and implementation of memory‑based algorithms.
• I/O Capacity — 744 user I/O pins accommodate broad external interfacing and parallel connections to peripherals and memory devices.
• Power and Voltage — Supports core supply voltages from 0.86 V to 1.15 V, enabling low‑voltage core operation consistent with the device family.
• Package and Mounting — Available in a 1152‑BBGA FCBGA (supplier package: 1152‑FBGA, 35×35) designed for surface‑mount assembly.
• Operating Grade and Temperature — Commercial grade device rated for 0 °C to 85 °C operation.
• Regulatory Compliance — RoHS compliant.

Typical Applications

• High‑speed interface implementations — Large I/O count and device architecture support complex external memory interfaces and high‑pin‑count signaling requirements.
• DSP and signal processing — High logic element count and embedded memory capacity enable implementation of mid‑range digital signal processing blocks and custom datapaths.
• Communication and protocol bridging — Extensive I/O and on‑chip resources allow protocol conversion and multi‑lane interface aggregation in commercial systems.

Unique Advantages

• High logical capacity: 142,500 logic elements provide the headroom to integrate complex control, data‑path, and interface logic in a single device, reducing system BOM.
• Substantial embedded memory: Approximately 6.54 Mbits of RAM enables local buffering, packet handling, and memory‑centric algorithms without immediate external memory dependence.
• Extensive external connectivity: 744 I/O pins support broad peripheral interfacing, parallel buses, and multiport designs for flexible board‑level integration.
• Compact surface‑mount package: The 1152‑FBGA (35×35) package delivers high I/O density in a standard surface‑mount form factor for space‑constrained PCBs.
• Commercial temperature rating: Specified for 0 °C to 85 °C operation for deployment in standard commercial environments.
• RoHS compliant: Environmentally compliant manufacturing and regulatory alignment.

Why Choose EP3SL150F1152C4N?

The EP3SL150F1152C4N delivers a balance of high logic density, significant embedded memory, and a very large I/O complement within a compact 1152‑ball BGA package. Its specifications make it suitable for commercial embedded and communications designs that require integrated logic, memory, and extensive external interfacing while maintaining a low‑voltage core supply.

This Stratix® III L FPGA is appropriate for engineering teams who need to consolidate multiple functions into a single device to reduce component count and simplify board design, while relying on a proven device family and available documentation for system integration.

Request a quote or submit a pricing inquiry to learn more about availability and lead times for EP3SL150F1152C4N.