EP3SL150F1152C4L

The EP3SL150F1152C4L is a Stratix® III L family FPGA from Intel, provided in a 1152-contact BGA (FCBGA) package. It delivers a high logic capacity and abundant I/O within a commercial temperature range for complex, programmable digital designs.

With 142,500 logic elements, approximately 6.54 Mbits of embedded memory and 744 I/Os, this device targets applications that require dense logic resources, substantial on-chip RAM, and large external interfacing in a surface-mount form factor.

Key Features

• Logic Capacity — 142,500 logic elements to implement large-scale, custom digital functions and parallel processing pipelines.
• Embedded Memory — Approximately 6.54 Mbits of on-chip RAM for buffering, lookup tables, and intermediate data storage.
• I/O Count — 744 I/Os to support extensive external interfaces and multi-channel connectivity.
• Power Supply — Core voltage range from 860 mV to 1.15 V for compatibility with targeted power domains and system architectures.
• Package and Mounting — 1152-BBGA (FCBGA) surface-mount package; supplier device package listed as 1152-FBGA (35×35) for compact, high-density board integration.
• Operating Grade and Temperature — Commercial grade with an operating temperature range of 0 °C to 85 °C.
• Regulatory — RoHS compliant.

Typical Applications

• High-density logic implementations — Use the 142,500 logic elements to consolidate complex combinational and sequential logic into a single FPGA device.
• Memory-intensive processing — Leverage approximately 6.54 Mbits of embedded RAM for buffering, data staging, and on-chip storage for algorithms that require moderate on-chip memory.
• I/O-heavy interface bridging — Deploy the 744 I/Os to connect multiple external peripherals, sensors, or high-channel-count interfaces in system designs.
• Compact system integration — The 1152-BBGA package and surface-mount mounting enable dense PCB layouts for space-constrained applications.

Unique Advantages

• Large logic resource pool: 142,500 logic elements provide headroom for complex state machines, pipelined datapaths, and parallel processing blocks.
• Substantial on-chip RAM: Approximately 6.54 Mbits of embedded memory reduces dependence on external RAM for many buffering and caching tasks.
• Extensive external connectivity: 744 I/Os enable multi-channel interfaces and support for diverse peripheral integration without multiplexing compromises.
• Compact, manufacturable package: 1152-BBGA (35×35) surface-mount package simplifies high-density PCB assembly and production.
• Commercial operating range: Rated for 0 °C to 85 °C to meet standard commercial deployment environments.
• RoHS compliant: Meets lead-free and restricted-substance requirements for modern electronics manufacturing.

Why Choose EP3SL150F1152C4L?

The EP3SL150F1152C4L combines a high count of logic elements, multi-megabit on-chip memory and a large I/O complement in a compact 1152-BBGA package, making it well suited for developers building complex, I/O-intensive digital systems within a commercial temperature range. Its core voltage flexibility and surface-mount format support modern board-level power and assembly practices.

This device is an option for teams needing significant programmable logic and embedded memory in a single FPGA from Intel’s Stratix® III L family, offering a balance of integration and capacity for demanding digital designs.

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