EP3SL150F1152C4LN

The EP3SL150F1152C4LN is a Stratix III L series FPGA in a 1152-ball FCBGA package that delivers large programmable logic capacity and extensive I/O. Built on the Stratix III architecture, this device combines 142,500 logic elements with embedded memory and series device features to support complex digital designs.

Its on-chip resources and I/O density make it suitable for designs that require high logic capacity, significant embedded memory, and multiple external interfaces within a compact surface-mount package.

Key Features

• Core Logic  142,500 logic elements provide high programmable logic capacity for complex combinational and sequential designs.
• Embedded Memory  Approximately 6.54 Mbits of on-chip RAM (6,543,360 total RAM bits) for local buffering, FIFOs, and state storage within the FPGA fabric.
• I/O Density  744 user I/O pins support extensive peripheral and system interfacing in multi-protocol designs.
• Stratix III Architecture Features  Family-level features documented in the Stratix III device handbook include logic array blocks, adaptive logic modules, TriMatrix embedded memory blocks, and DSP blocks for signal processing tasks.
• High-Speed Interfaces and External Memory Support  Device family documentation includes high-speed differential I/O interfaces with DPA and dedicated external memory interface support for system-level connectivity.
• Clocking and Configuration  Stratix III family provisions include clock networks, PLLs, device configuration options, and IEEE 1149.1 (JTAG) boundary-scan testing as described in the device handbook.
• Power and Voltage  Supported core voltage range is 0.86 V to 1.15 V, enabling integration with systems targeting low-voltage FPGA cores.
• Package and Mounting  1152-BBGA (FCBGA) supplier device package 1152-FBGA (35×35), surface-mount for high-density board designs.
• Operating Conditions  Commercial grade operation with an operating temperature range of 0 °C to 85 °C.
• Reliability and Security  Series documentation highlights design security features, SEU mitigation approaches, and remote system upgrade capabilities available across the Stratix III family.
• Environmental Compliance  RoHS compliant.

Typical Applications

• High-performance signal processing  Leverage the Stratix III DSP blocks and large logic capacity for algorithms and data-path implementations requiring sizable compute and memory resources.
• Multi-interface bridging and I/O aggregation  744 I/O pins enable consolidation of multiple peripherals or protocol interfaces in a single device for system integration and board-level consolidation.
• Embedded memory–intensive designs  Approximately 6.54 Mbits of on-chip RAM supports buffering, packet handling, and local data storage without immediate external memory dependency.
• System prototyping and integration  High logic density in a 1152-FBGA package allows evaluation and integration of complex functions in compact, surface-mount form factors.

Unique Advantages

• High logic capacity: 142,500 logic elements provide headroom for complex control, processing, and glue-logic implementations.
• Substantial embedded RAM: Approximately 6.54 Mbits of on-chip memory reduces reliance on external RAM for many buffer and storage needs.
• Extensive I/O count: 744 I/O pins enable dense connectivity for multi-channel systems and interface-rich applications.
• Compact, production-ready package: 1152-BBGA (35×35) surface-mount package balances high pin count with board space efficiency.
• Commercial temperature rating: Operation across 0 °C to 85 °C aligns with a wide range of standard commercial electronics applications.
• Series-level system features: Stratix III family documentation details support for clocking, configuration, security, JTAG testing, and SEU mitigation that help streamline system design and validation.

Why Choose EP3SL150F1152C4LN?

The EP3SL150F1152C4LN delivers a combination of high programmable logic density, significant on-chip memory, and abundant I/O in a compact 1152-FBGA package, making it well suited for complex digital designs that require integration of many functions on a single FPGA. Its Stratix III family features—documented clocking, memory, DSP and configuration capabilities—provide a stable platform for developing high-capacity, interface-rich systems.

This device is targeted at customers and designs that need scalable logic resources, embedded memory for local data handling, and high I/O counts within a commercial temperature envelope, while also benefiting from family-level documentation for design and system integration.

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