EP3SL150F780C3

The EP3SL150F780C3 is a Stratix® III L field programmable gate array (FPGA) offered in a 780-FBGA package. It delivers large on-chip logic capacity and memory with a high I/O count, supporting complex digital designs that require substantial integration of custom logic, I/O interfacing, and embedded RAM.

Designed for commercial-grade applications, this device combines 142,500 logic elements with approximately 6.54 Mbits of embedded memory and 488 I/Os, providing the building blocks for dense, high-functionality FPGA implementations.

Key Features

• Core Logic 142,500 logic elements (cells) to implement extensive custom logic and state machines.
• Embedded Memory Approximately 6.54 Mbits of on-chip RAM to support buffering, lookup tables, and local storage.
• I/O Density 488 general-purpose I/O pins to support multi-channel interfacing and high connector density.
• Package 780-FBGA package (780-BBGA, FCBGA footprint) with supplier device package listed as 780-FBGA (29 × 29).
• Power Core voltage supply range from 860 mV to 1.15 V, enabling operation across defined supply conditions.
• Thermal and Grade Commercial temperature range of 0 °C to 85 °C, suitable for standard commercial applications.
• Mounting and Compliance Surface-mount device with RoHS compliance for regulatory compatibility in lead-free assemblies.

Typical Applications

• High-density digital logic Implement complex finite-state machines, pipelined datapaths, and custom logic functions that require large logic capacity.
• I/O-intensive interface bridging Support multiple parallel or serial interfaces and protocol translation with the device's 488 I/Os.
• Embedded memory buffering Use the approximately 6.54 Mbits of on-chip RAM for packet buffering, FIFOs, and temporary data storage within logic paths.
• FPGA-based system integration Integrate compute, control, and I/O functions into a single FPGA package to reduce external component count.

Unique Advantages

• Large logic capacity: 142,500 logic elements allow designers to implement sizable custom architectures without partitioning across multiple devices.
• Significant on-chip memory: Approximately 6.54 Mbits of embedded RAM reduces reliance on external memory for many buffering and state-storage tasks.
• High I/O count: 488 I/Os enable dense external connectivity for multi-channel and high-pin-count interfaces.
• Compact BGA package: 780-FBGA (29 × 29) package supports high pin density in a surface-mount footprint for space-constrained boards.
• Commercial-grade operation: Specified operation from 0 °C to 85 °C aligns with standard commercial application requirements.
• RoHS compliant: Meets lead-free assembly requirements for regulated markets.

Why Choose EP3SL150F780C3?

The EP3SL150F780C3 positions itself as a high-capacity Stratix® III L FPGA option for designs that need a combination of large logic resources, ample embedded memory, and broad I/O connectivity in a single, surface-mount BGA package. Its specifications make it appropriate for commercial electronic systems where integration density and on-chip memory are critical design drivers.

Engineers and procurement teams targeting scalable FPGA-based designs will find this device useful for consolidating functions, simplifying board-level routing with high I/O counts, and leveraging significant embedded RAM to reduce external component dependence.

Request a quote or submit an inquiry to receive pricing and availability for the EP3SL150F780C3 and to discuss how it fits your design requirements.