EP3SL150F780C3N

IC FPGA 488 I/O 780FBGA
Part Description

Stratix® III L Field Programmable Gate Array (FPGA) IC 488 6543360 142500 780-BBGA, FCBGA

Quantity 401 Available (as of October 8, 2026)
Product CategoryField Programmable Gate Array (FPGA)
ManufacturerIntel
Manufacturing StatusObsolete
Manufacturer Standard Lead TimeContact Us
Datasheet

Specifications & Environmental

Device Package780-FBGA (29x29)GradeCommercialOperating Temperature0°C – 85°C
Package / Case780-BBGA, FCBGANumber of I/O488Voltage860 mV - 1.15 V
Mounting MethodSurface MountRoHS ComplianceRoHS CompliantREACH ComplianceREACH Unknown
Moisture Sensitivity Level4 (72 Hours)Number of LABs/CLBs5700Number of Logic Elements/Cells142500
Number of GatesN/AECCN3A001A7AHTS Code8542.39.0001
QualificationN/ATotal RAM Bits6543360

Overview of EP3SL150F780C3N – Stratix® III L FPGA, 142,500 logic elements, 488 I/Os, 780‑BBGA

The EP3SL150F780C3N is a Stratix® III L field-programmable gate array (FPGA) from Intel. It combines a large logic fabric with embedded memory, DSP resources and a rich I/O structure to support complex programmable logic designs.

Designed for commercial‑grade systems, this device provides 142,500 logic elements, approximately 6.54 Mbits of embedded memory and 488 I/Os in a 780‑ball BGA (29×29) surface‑mount package. The device supports a core supply range of 860 mV to 1.15 V and an operating temperature range of 0 °C to 85 °C.

Key Features

  • Logic Capacity  Provides 142,500 logic elements suitable for large-scale programmable functions and complex state machines.
  • Embedded Memory  Approximately 6.54 Mbits of on‑chip RAM delivered through TriMatrix embedded memory blocks for buffering, FIFOs and on‑chip data storage.
  • I/O Resources  488 user I/Os support a variety of board‑level interfacing needs, including multi‑bank I/O structure.
  • DSP and High‑Speed Interfaces  Includes dedicated DSP blocks and support for high‑speed differential I/O interfaces with DPA to facilitate signal processing and high‑bandwidth links (as detailed in the device handbook).
  • Clocking and PLLs  Integrated clock networks and PLL circuitry provide flexible clock distribution and management for synchronous designs.
  • Configuration and Test  Supports standard configuration features and IEEE 1149.1 (JTAG) boundary‑scan testing for device programming and board testability.
  • Power and Supply  Core voltage supply range from 860 mV to 1.15 V with device support for programmable power options described in the device handbook.
  • Package & Mounting  780‑BBGA (FCBGA) package, supplier designation 780‑FBGA (29×29), intended for surface‑mount assembly.
  • Commercial Grade & Temperature  Commercial grade device rated for operation from 0 °C to 85 °C. RoHS compliant.
  • Reliability Features  Includes design security and SEU mitigation features outlined in the Stratix III device handbook to support long‑running and reconfigurable systems.

Typical Applications

  • FPGA‑based system control  Implements complex control logic and state machines using the device’s large logic capacity and rich I/O.
  • High‑speed interface bridging  Acts as a protocol bridge or interface adapter leveraging the high‑speed differential I/O support and numerous user I/Os.
  • Signal processing and DSP acceleration  Uses embedded DSP blocks and on‑chip RAM for FIR filters, FFTs and other real‑time signal processing tasks.
  • Memory controller and buffering  Host external memory interfaces and on‑chip TriMatrix memory to implement buffering, memory controllers and data path staging.

Unique Advantages

  • Large, integrated logic fabric: 142,500 logic elements enable consolidation of multiple functions into a single FPGA, reducing board complexity.
  • Substantial on‑chip memory: Approximately 6.54 Mbits of embedded RAM lowers dependency on external memory for many buffering and packet‑processing tasks.
  • Extensive I/O count: 488 I/Os provide flexibility for multi‑lane interfaces, parallel buses and mixed‑signal board designs.
  • Flexible clocking and DSP support: Dedicated clock networks, PLLs and DSP blocks simplify implementation of timing‑sensitive and high‑throughput data paths.
  • Commercial availability and RoHS compliance: Commercial grade temperature range and RoHS compliance support standard commercial production and environmental requirements.
  • Surface‑mount BGA packaging: 780‑ball FCBGA (29×29) package supports compact, high‑density board layouts for space‑constrained systems.

Why Choose EP3SL150F780C3N?

The EP3SL150F780C3N places a high logic capacity, sizable embedded memory and extensive I/O resources into a single commercial‑grade Stratix III L FPGA package. Its combination of DSP blocks, programmable clocking, high‑speed I/O support and on‑chip memory makes it suitable for designs that require substantial programmable logic, interface flexibility and on‑chip data handling.

For engineers building board‑level systems that need consolidation of multiple functions into one device, the EP3SL150F780C3N offers a balance of integration and configurable resources, backed by the Stratix III device handbook documentation and standard configuration and test features.

If you would like pricing, availability or to request a quote for EP3SL150F780C3N, submit a request and our team will respond with the next steps to procure this device.

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