EP3SL150F780C4G

The EP3SL150F780C4G is an Intel Stratix III family FPGA delivered in a 780-ball FCBGA package for surface-mount assembly. It provides 142,500 logic elements and approximately 6.54 Mbits of embedded RAM, making it suitable for high-performance logic, DSP and embedded system functions where on-chip resources and configurable I/O are required.

Designed for commercial-grade applications, this device balances high integration and configurable power/voltage options. Its Stratix III heritage brings architectural features focused on performance and power management for complex digital and signal-processing tasks.

Key Features

• Logic Capacity  142,500 logic elements (LEs) for implementing complex combinational and sequential logic.
• Embedded Memory  Approximately 6.54 Mbits of on-chip RAM to support buffering, FIFOs and memory-centric functions.
• I/O  488 user I/O pins to interface with external peripherals, memory and high-speed links in a compact package.
• Power and Voltage  Selectable core voltage operation across a supply range of 860 mV to 1.15 V to enable trade-offs between performance and power consumption.
• Package & Mounting  780-ball FCBGA (29×29) package, surface-mount mounting type for dense board integration.
• Operating Range  Commercial-grade temperature range of 0 °C to 85 °C to match typical commercial electronic applications.
• Family-Level Architecture  Built on the Stratix III device architecture which includes programmable power technology, DSP block support, multiple PLLs and robust memory interface features (as described in the Stratix III device handbook).
• Compliance  RoHS compliant to support lead-free assemblies and environmental regulatory requirements.

Typical Applications

• High-Performance DSP  Implement real-time signal-processing pipelines and accelerator functions using abundant logic and embedded RAM.
• Embedded Systems  Integrate custom control logic, protocol processing and on-chip state machines for embedded products.
• Networking & Communications  Enable protocol bridging, packet processing and interface adaptation where configurable I/O and on-chip buffering are required.
• Memory Interfaces  Use the Stratix III family memory-interface features to build controllers and PHY adapters for external DRAM and high-speed memories.

Unique Advantages

• Substantial Logic Resource: 142,500 logic elements enable consolidation of multiple functions on a single device, reducing board count and BOM complexity.
• Significant On-Chip Memory: Approximately 6.54 Mbits of embedded RAM supports deep buffering and data-path staging without immediate reliance on external memory.
• Configurable Power Envelope: Core voltage range (860 mV–1.15 V) supports tuning for performance versus power, aligning device operation with system power budgets.
• Commercial Temperature Suitability: Rated for 0 °C to 85 °C operation for a wide set of commercial electronics applications.
• Compact FCBGA Packaging: 780-ball FCBGA (29×29) provides a high pin-count, space-efficient solution for dense system designs.
• Regulatory Readiness: RoHS compliance simplifies adoption into lead-free manufacturing processes.

Why Choose EP3SL150F780C4G?

The EP3SL150F780C4G combines a high count of logic elements and substantial embedded memory with configurable core-voltage operation in a compact FCBGA footprint. It is well suited for designers who need to implement complex logic, DSP algorithms, and memory-centric functions on a single device while maintaining control over power and thermal behavior.

This device is aimed at commercial applications that require scalable programmable logic resources, flexible I/O integration, and established Stratix III architectural capabilities. Its combination of integration and configurability helps streamline system design, reduce external component count, and accelerate time-to-market.

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