EP3SL150F780C4

The EP3SL150F780C4 is a Stratix® III L family Field Programmable Gate Array (FPGA) offered by Intel. It provides a high logic capacity device with 142,500 logic elements and approximately 6.54 Mbits of embedded memory for designs that require significant on-chip resources.

Key device attributes include 488 user I/O pins, a 780-ball FCBGA package (780-FBGA, 29×29), a low-voltage core supply range of 0.86 V to 1.15 V, and a commercial operating temperature range of 0 °C to 85 °C. The device is RoHS compliant and intended for surface-mount board assembly.

Key Features

• Core Logic Capacity  142,500 logic elements provide substantial programmable fabric for complex custom logic, state machines, and datapath implementations.
• Embedded Memory  Approximately 6.54 Mbits of on-chip RAM to support large buffering, FIFO, and storage requirements without external memory.
• I/O Resources  488 user I/O pins enable broad interfacing options to peripherals, buses, and external devices.
• Power  Core supply voltage range from 0.86 V to 1.15 V allows integration into low-voltage power domains while meeting device requirements.
• Package and Assembly  780-ball FCBGA package (780-FBGA, 29×29) in a surface-mount form factor suitable for compact board layouts.
• Operating Range  Commercial grade with an operating temperature range of 0 °C to 85 °C for standard commercial environments.
• Regulatory  RoHS compliant, supporting compliance goals for lead-free manufacturing.

Typical Applications

• High-density digital designs  Use the device where significant programmable logic and on-chip memory are required to consolidate functions and reduce external components.
• I/O-rich systems  Leverage the 488 I/O pins to interface multiple peripherals, buses, or front-end devices directly to the FPGA fabric.
• Embedded memory buffering  Employ the approximately 6.54 Mbits of embedded RAM for data buffering, FIFOs, and temporary storage without adding external RAM.

Unique Advantages

• High logic density: 142,500 logic elements enable implementation of complex algorithms and large custom logic blocks within a single device.
• Substantial embedded memory: Approximately 6.54 Mbits of on-chip RAM reduce dependence on external memory components and simplify board design.
• Ample I/O count: 488 user I/Os allow flexible connectivity for multi-interface systems and dense integration of sensors and peripherals.
• Compact FCBGA package: 780-FBGA (29×29) delivers a high-pin-count solution in a surface-mount package suitable for space-constrained PCBs.
• Low-voltage core support: The 0.86 V to 1.15 V supply range supports integration into modern low-voltage power architectures.
• Commercial-grade and RoHS compliant: Designed for commercial temperature environments and compliant with lead-free manufacturing requirements.

Why Choose EP3SL150F780C4?

The EP3SL150F780C4 balances high programmable logic capacity, on-chip memory, and extensive I/O in a single Stratix® III L FPGA package. Its combination of 142,500 logic elements, approximately 6.54 Mbits of embedded RAM, and 488 I/O pins makes it suitable for designs that need dense integration of logic and memory while minimizing external components.

This device is well suited for teams and projects targeting commercial-temperature applications that require a compact surface-mount 780-FBGA package and RoHS-compliant components. Its specifications support scalable designs where on-chip resources and a high I/O count are key selection criteria.

Request a quote or submit a product inquiry to receive pricing and availability for the EP3SL150F780C4 and to discuss how it can meet your project requirements.