EP3SL150F780C4L

The EP3SL150F780C4L is a Stratix® III L field programmable gate array (FPGA) in a 780-ball FBGA surface-mount package. It provides a high-density, commercial-grade programmable logic platform with a large logic element count and substantial on-chip RAM for designers building configurable digital systems.

With 142,500 logic elements, approximately 6.54 Mbits of embedded memory and 488 I/Os, this device is intended for commercial electronic applications that require significant logic capacity, flexible I/O resources and compact BGA packaging.

Key Features

• Logic Capacity  142,500 logic elements provide extensive programmable logic resources for complex digital designs.
• Embedded Memory  Approximately 6.54 Mbits of on‑chip RAM to support buffering, state machines and data processing functions within the FPGA fabric.
• I/O and Connectivity  488 user I/Os allow broad external interfacing and system integration options for multi‑signal applications.
• Package and Mounting  780-FBGA (29×29) package, surface‑mountable in a 780‑BBGA / FCBGA footprint for dense board-level integration.
• Power  Operates with a core voltage supply range of 860 mV to 1.15 V to match common FPGA core power rails.
• Operating Conditions  Commercial grade with an operating temperature range of 0 °C to 85 °C and RoHS compliance for environmental compatibility.

Typical Applications

• Commercial Communications Equipment  Use the large logic and I/O resources to implement custom protocol processing and interface bridging in commercial networking gear.
• Data Processing and Acceleration  Leverage the high logic element count and embedded RAM for data-path acceleration, buffering and custom dataplane functions.
• Prototyping and System Integration  Ideal for development platforms and system designs that require flexible, reconfigurable logic and a high I/O count in a compact BGA package.

Unique Advantages

• High Logic Density: 142,500 logic elements enable implementation of complex state machines and wide datapaths within a single device.
• Significant Embedded Memory: Approximately 6.54 Mbits of on‑chip RAM reduce the need for external memory in many buffering and caching use cases.
• Extensive I/O Count: 488 I/Os support multi-channel interfacing and rich peripheral connectivity without external multiplexing.
• Compact BGA Packaging: 780-FBGA (29×29) offers a high pin count in a compact surface‑mount footprint for space-constrained boards.
• Commercial Temperature and RoHS Compliance: Rated 0 °C to 85 °C and RoHS compliant to meet typical commercial product requirements and regulatory expectations.
• Flexible Core Supply Range: Core voltage range of 860 mV to 1.15 V accommodates common FPGA power architectures.

Why Choose EP3SL150F780C4L?

The EP3SL150F780C4L delivers a balance of high logic capacity, embedded memory and extensive I/O in a compact 780‑ball FBGA package, making it well suited for commercial designs that need substantial programmable resources without sacrificing board area. Its commercial temperature rating and RoHS compliance align with typical product development and manufacturing requirements.

Designers targeting scalable, reconfigurable implementations will find the combination of 142,500 logic elements, approximately 6.54 Mbits of on‑chip RAM and 488 I/Os advantageous for consolidating functions into a single device while maintaining flexibility for updates and revisions.

Request a quote or submit an inquiry to receive pricing and availability for the EP3SL150F780C4L. Our team can provide lead-time information and assist with volume and procurement requests.