EP3SL150F780C4LN

The EP3SL150F780C4LN is a Stratix® III L field programmable gate array (FPGA) in a 780-FBGA package designed for commercial-grade applications. The device integrates a high logic element count with substantial on-chip memory and a large I/O complement to support complex digital designs.

Built around the Stratix III architecture, the device targets applications that require dense logic integration, embedded memory and DSP resources, and flexible I/O — all in a surface-mount 780-BBGA (780-FBGA) footprint. Key value comes from its combination of 142,500 logic elements, approximately 6.54 Mbits of embedded memory, and 488 I/O pins for broad system integration.

Key Features

• Core Logic  142,500 logic elements provide a high-density fabric for implementing complex combinational and sequential logic.
• Embedded Memory  Approximately 6.54 Mbits of on-chip RAM (6,543,360 bits) for data buffering, FIFOs, and embedded storage.
• I/O Capacity  488 I/O pins to support wide parallel interfaces and multiple independent I/O banks for system connectivity.
• Package and Mounting  780-BBGA, supplied as 780-FBGA (29×29) in a surface-mount package for compact board integration.
• Power and Supply Range  Core supply operating range from 860 mV to 1.15 V to match system power rails and enable power-optimized designs.
• Operating Conditions and Grade  Commercial grade device rated for operation from 0 °C to 85 °C and compliant with RoHS environmental requirements.
• Architecture Features  Series-level architecture includes TriMatrix embedded memory blocks, DSP blocks, MultiTrack interconnect, clock networks with PLLs, and high-speed differential I/O support with DPA as described in the Stratix III device handbook.
• Configuration and Test  Device-level features described in the series handbook include configuration mechanisms, IEEE 1149.1 (JTAG) boundary-scan testing, remote system upgrade support, and design security provisions.
• System Reliability Features  Series documentation references SEU mitigation and programmable power features to help manage reliability and power behavior in deployed systems.

Typical Applications

• High-speed interface and bridging  Use the device's large I/O count and high-density logic to implement external memory interfaces, protocol bridging, and parallel/serial interface conversion.
• Signal processing and DSP  DSP blocks and substantial embedded memory enable implementation of filtering, arithmetic pipelines, and other mid- to high-throughput signal-processing functions.
• System control and aggregation  Combine logic density and numerous I/O to perform centralized control, aggregation, and glue logic for multi-module systems.

Unique Advantages

• High logic density: 142,500 logic elements allow large, integrated designs without splitting functionality across multiple ICs.
• Significant on-chip memory: Approximately 6.54 Mbits of embedded RAM reduces dependence on external memory for many buffering and storage needs.
• Extensive I/O: 488 I/O pins provide flexibility for parallel interfaces and multiple dedicated I/O banks, simplifying board-level routing.
• Compact package: 780-FBGA (29×29) surface-mount package balances pin count with a small footprint for dense PCB layouts.
• Power flexibility: Core voltage support from 860 mV to 1.15 V helps match the device to target system power architectures.
• Commercial availability and compliance: Commercial-grade rating (0 °C to 85 °C) and RoHS compliance support broad deployment in standard electronics products.

Why Choose EP3SL150F780C4LN?

The EP3SL150F780C4LN delivers a balance of high logic capacity, embedded memory, and abundant I/O in a compact 780-FBGA surface-mount package, making it suitable for designs that require integrated digital processing, interface bridging, and substantial on-chip storage. Series-level architecture elements such as TriMatrix memory blocks, DSP resources, and advanced clocking and I/O capabilities give designers the building blocks needed for sophisticated systems.

This device is well suited to design teams and procurement groups looking for a commercially graded FPGA with verifiable on-chip resources and defined operating conditions. Its combination of logic density, memory, I/O count and configuration/test features supports scalable designs and long-term maintainability within the Stratix III product family.

If you would like pricing, availability, or to request a formal quote for EP3SL150F780C4LN, submit an inquiry or request a quote through your preferred procurement channel.