EP3SL150F780I3G

The EP3SL150F780I3G is an Intel Stratix III FPGA delivered in a 780-ball FCBGA package designed for demanding industrial applications. It combines a high-density logic fabric with multi-megabit embedded memory, flexible high-speed I/O, and scalable clocking and DSP resources for compute- and connectivity-focused designs.

Targeted at systems requiring programmable acceleration, protocol bridging, and memory interface support, this device offers selectable core voltage and power management capabilities to balance performance and power consumption within a compact surface-mount package.

Key Features

• Logic Capacity — 142,500 logic elements for implementing complex control, signal-processing, and custom accelerator functions.
• Embedded Memory — Approximately 6.54 Mbits of on-chip RAM for FIFOs, buffers, and on-chip data storage.
• I/O and Packaging — 488 user I/O pins in a 780-ball FCBGA (29×29) surface-mount package to support dense board-level connectivity and modular I/O bank architectures.
• Core Voltage Range — Selectable core supply from 0.86 V to 1.15 V to tune performance and power consumption.
• Industrial Temperature Range — Rated for operation from −40 °C to 100 °C for reliable operation in industrial environments.
• Programmable Power and Clocking — Family-level features include Programmable Power Technology and selectable core voltage, up to 16 global clocks and multiple regional/peripheral clocks, and up to 12 PLLs for flexible clock synthesis and phase control.
• High-Speed DSP and SERDES — Stratix III family DSP blocks and high-speed I/O with SERDES and dynamic phase alignment support for multi-gigabit interfaces and high-performance multiply-accumulate operations.
• System Reliability and Security — Family features include configuration memory CRC, optional AES encryption for configuration bitstream protection, and on-chip error detection/correction for embedded memory.
• Standards and Compliance — RoHS-compliant manufacturing and industrial-grade specification for regulated production environments.

Typical Applications

• High-Speed Networking — Implement packet processing, protocol bridging, and multi-gigabit serial interfaces supported by SERDES and phase-aligned I/O.
• Signal Processing and DSP Acceleration — Deploy dedicated DSP blocks and abundant logic elements for FIR filters, FFTs, and real-time data path acceleration.
• Memory Interface Controllers — Build controllers and interfaces for DDR, DDR2, DDR3, RLDRAM II, and QDR-class memories using the device’s modular I/O and DQS support.
• Industrial Control and Automation — Leverage industrial temperature rating and robust I/O to implement motor control, sensor aggregation, and deterministic logic functions.
• Embedded System Prototyping — Rapid system integration and on-chip resources support development of custom processors, accelerators, and system prototypes.

Unique Advantages

• High-density programmable fabric: 142,500 logic elements let you integrate complex logic and accelerators on a single device, reducing board-level components.
• Multi-megabit on-chip RAM: Approximately 6.54 Mbits of embedded memory supports deep buffering and low-latency data paths without external memory.
• Flexible performance vs. power: Selectable core voltage (0.86–1.15 V) and programmable power features enable designers to balance throughput and energy use.
• Robust industrial operation: −40 °C to 100 °C rating and RoHS compliance support deployment in industrial and regulated environments.
• Comprehensive timing and clock resources: Extensive clocking and PLL options simplify multi-clock designs and high-performance timing architectures.
• Secure and reliable configuration: Family-level CRC and optional AES configuration encryption plus on-chip ECC protect configuration and user memory integrity.

Why Choose EP3SL150F780I3G?

The EP3SL150F780I3G positions itself as a high-capacity, industrial-grade Stratix III FPGA suitable for applications that require substantial logic density, multi-megabit embedded memory, and flexible high-speed I/O in a compact FCBGA package. Its selectable core voltage and power-management features let engineering teams optimize designs for performance or efficiency without changing hardware.

This device is well suited for system designers building communications, signal-processing, embedded prototyping, or industrial control solutions who need a reliable, feature-rich programmable platform backed by a mature device family and configuration/clocking capabilities described in the Stratix III device documentation.

Request a quote or submit an inquiry to check availability and pricing for EP3SL150F780I3G and to discuss volume, lead times, or technical fit for your project.