EP3SL150F780I4G
| Part Description |
Field Programmable Gate Array (FPGA) IC |
|---|---|
| Quantity | 332 Available (as of October 8, 2026) |
| Product Category | Field Programmable Gate Array (FPGA) |
|---|---|
| Manufacturer | Intel |
| Manufacturing Status | Active |
| Manufacturer Standard Lead Time | 26 Weeks |
| Datasheet |
Specifications & Environmental
| Device Package | 780-FBGA (29x29) | Grade | Industrial | Operating Temperature | -40°C – 100°C | ||
|---|---|---|---|---|---|---|---|
| Package / Case | 780-BBGA, FCBGA | Number of I/O | 488 | Voltage | 860 mV - 1.15 V | ||
| Mounting Method | Surface Mount | RoHS Compliance | RoHS Compliant | REACH Compliance | REACH Unaffected | ||
| Moisture Sensitivity Level | 3 (168 Hours) | Number of LABs/CLBs | 5700 | Number of Logic Elements/Cells | 142500 | ||
| Number of Gates | N/A | ECCN | N/A | HTS Code | N/A | ||
| Qualification | N/A | Total RAM Bits | 6543360 |
Overview of EP3SL150F780I4G – Field Programmable Gate Array (FPGA) IC
The EP3SL150F780I4G is an industrial-grade Stratix® III family FPGA from Intel, designed for high-performance, configurable logic and embedded memory in demanding systems. It combines 142,500 logic elements with approximately 6.54 Mbits of embedded memory and 488 user I/O pins in a 780-ball FCBGA (29×29) surface-mount package, delivering a scalable platform for complex digital signal processing, high-speed interfaces, and system integration.
Built on the Stratix III architecture, this device targets applications that require a balance of performance, integration, and power efficiency—leveraging family features such as selectable core voltage, programmable power management, and advanced on-chip reliability mechanisms.
Key Features
- Logic Capacity Provides 142,500 logic elements for implementing large-scale custom logic, state machines, and control functions.
- Embedded Memory Approximately 6.54 Mbits of on-chip RAM for FIFOs, buffers, and memory-mapped data storage.
- Rich I/O 488 user I/O pins supported in modular I/O banks to interface with external memory, peripherals, and high-speed links.
- Package & Mounting 780-ball FCBGA (29×29) surface-mount package suitable for compact, board-level integration.
- Power and Core Voltage Selectable core voltage operation with an operating supply range of 860 mV to 1.15 V for tuning performance versus power consumption.
- Industrial Temperature Range Rated for operation from −40 °C to 100 °C to meet industrial deployment conditions.
- Stratix III Family Capabilities Includes family-level features such as Programmable Power Technology, high-speed DSP block support for efficient multipliers and MAC functions, selectable core-voltage optimization, and optional 256-bit AES encryption for configuration security.
- System Reliability Family-level support for configuration-memory CRC and ECC in embedded memory blocks to detect and mitigate data corruption.
- RoHS Compliance RoHS-compliant device suitable for environmentally regulated designs.
Typical Applications
- High-Speed Communications Implement SERDES-based links, protocol bridging, and packet-processing logic using the device's high I/O count and Stratix III I/O features.
- Digital Signal Processing Deploy DSP pipelines, FIR filters, and multiplier-accumulate chains using the Stratix III family DSP architecture and abundant logic resources.
- Memory Interface Controllers Build controllers for DDR/DDR2/DDR3 and other external memories leveraging modular I/O banks and dedicated memory interface support from the Stratix III family.
- Industrial Control and Automation Use configurable logic and robust temperature range for motion control, sensor aggregation, and real-time system management in industrial environments.
Unique Advantages
- High Integration: Large logic capacity and multi-megabit embedded memory reduce the need for external components and lower BOM complexity.
- Flexible Power/Performance Trade-offs: Selectable core voltage and programmable power features allow designers to tune device power consumption based on performance needs.
- Robust I/O Count: 488 user I/Os in a single package enable complex system interfaces without multi-device partitioning.
- Industrial Reliability: Rated for −40 °C to 100 °C operation and includes family-level ECC/CRC support for enhanced data integrity in deployed systems.
- Security and Maintainability: Stratix III family support for AES configuration encryption and configuration error detection helps protect intellectual property and improve system availability.
Why Choose EP3SL150F780I4G?
The EP3SL150F780I4G combines sizable logic capacity, multi-megabit embedded memory, and a high I/O count in a single industrial-grade FCBGA package—making it well suited for engineers designing high-performance communications, DSP-heavy, and industrial control systems. Its Stratix III family attributes—programmable power management, selectable core voltage, and on-chip reliability features—provide practical levers to balance performance, power, and system robustness across product lifecycles.
For teams seeking a scalable, high-density FPGA platform with family-proven architectural features and industrial operating range, the EP3SL150F780I4G offers a compelling foundation for complex, long-lived designs.
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