EP3SL150F780I4G

IC FPGA 488 I/O 780FBGA
Part Description

Field Programmable Gate Array (FPGA) IC

Quantity 332 Available (as of October 8, 2026)
Product CategoryField Programmable Gate Array (FPGA)
ManufacturerIntel
Manufacturing StatusActive
Manufacturer Standard Lead Time26 Weeks
Datasheet

Specifications & Environmental

Device Package780-FBGA (29x29)GradeIndustrialOperating Temperature-40°C – 100°C
Package / Case780-BBGA, FCBGANumber of I/O488Voltage860 mV - 1.15 V
Mounting MethodSurface MountRoHS ComplianceRoHS CompliantREACH ComplianceREACH Unaffected
Moisture Sensitivity Level3 (168 Hours)Number of LABs/CLBs5700Number of Logic Elements/Cells142500
Number of GatesN/AECCNN/AHTS CodeN/A
QualificationN/ATotal RAM Bits6543360

Overview of EP3SL150F780I4G – Field Programmable Gate Array (FPGA) IC

The EP3SL150F780I4G is an industrial-grade Stratix® III family FPGA from Intel, designed for high-performance, configurable logic and embedded memory in demanding systems. It combines 142,500 logic elements with approximately 6.54 Mbits of embedded memory and 488 user I/O pins in a 780-ball FCBGA (29×29) surface-mount package, delivering a scalable platform for complex digital signal processing, high-speed interfaces, and system integration.

Built on the Stratix III architecture, this device targets applications that require a balance of performance, integration, and power efficiency—leveraging family features such as selectable core voltage, programmable power management, and advanced on-chip reliability mechanisms.

Key Features

  • Logic Capacity  Provides 142,500 logic elements for implementing large-scale custom logic, state machines, and control functions.
  • Embedded Memory  Approximately 6.54 Mbits of on-chip RAM for FIFOs, buffers, and memory-mapped data storage.
  • Rich I/O  488 user I/O pins supported in modular I/O banks to interface with external memory, peripherals, and high-speed links.
  • Package & Mounting  780-ball FCBGA (29×29) surface-mount package suitable for compact, board-level integration.
  • Power and Core Voltage  Selectable core voltage operation with an operating supply range of 860 mV to 1.15 V for tuning performance versus power consumption.
  • Industrial Temperature Range  Rated for operation from −40 °C to 100 °C to meet industrial deployment conditions.
  • Stratix III Family Capabilities  Includes family-level features such as Programmable Power Technology, high-speed DSP block support for efficient multipliers and MAC functions, selectable core-voltage optimization, and optional 256-bit AES encryption for configuration security.
  • System Reliability  Family-level support for configuration-memory CRC and ECC in embedded memory blocks to detect and mitigate data corruption.
  • RoHS Compliance  RoHS-compliant device suitable for environmentally regulated designs.

Typical Applications

  • High-Speed Communications  Implement SERDES-based links, protocol bridging, and packet-processing logic using the device's high I/O count and Stratix III I/O features.
  • Digital Signal Processing  Deploy DSP pipelines, FIR filters, and multiplier-accumulate chains using the Stratix III family DSP architecture and abundant logic resources.
  • Memory Interface Controllers  Build controllers for DDR/DDR2/DDR3 and other external memories leveraging modular I/O banks and dedicated memory interface support from the Stratix III family.
  • Industrial Control and Automation  Use configurable logic and robust temperature range for motion control, sensor aggregation, and real-time system management in industrial environments.

Unique Advantages

  • High Integration:  Large logic capacity and multi-megabit embedded memory reduce the need for external components and lower BOM complexity.
  • Flexible Power/Performance Trade-offs:  Selectable core voltage and programmable power features allow designers to tune device power consumption based on performance needs.
  • Robust I/O Count:  488 user I/Os in a single package enable complex system interfaces without multi-device partitioning.
  • Industrial Reliability:  Rated for −40 °C to 100 °C operation and includes family-level ECC/CRC support for enhanced data integrity in deployed systems.
  • Security and Maintainability:  Stratix III family support for AES configuration encryption and configuration error detection helps protect intellectual property and improve system availability.

Why Choose EP3SL150F780I4G?

The EP3SL150F780I4G combines sizable logic capacity, multi-megabit embedded memory, and a high I/O count in a single industrial-grade FCBGA package—making it well suited for engineers designing high-performance communications, DSP-heavy, and industrial control systems. Its Stratix III family attributes—programmable power management, selectable core voltage, and on-chip reliability features—provide practical levers to balance performance, power, and system robustness across product lifecycles.

For teams seeking a scalable, high-density FPGA platform with family-proven architectural features and industrial operating range, the EP3SL150F780I4G offers a compelling foundation for complex, long-lived designs.

Request a quote or submit an inquiry to obtain pricing, availability, and technical support for EP3SL150F780I4G.

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