EP3SL150F780I4

The EP3SL150F780I4 is a Stratix® III L Field Programmable Gate Array (FPGA) from Intel, delivered in a 780-BBGA (FCBGA) package. It provides high logic capacity and substantial on-chip memory in an industrial-grade, surface-mount package.

With a nominal core supply range of 860 mV to 1.15 V and an operating temperature range of −40 °C to 100 °C, this device targets systems that require dense programmable logic, ample embedded memory, and extended temperature operation.

Key Features

• High Logic Density — 142,500 logic elements provide a large resource pool for complex digital designs and custom logic implementations.
• Logic Blocks — 5,700 logic blocks for partitioning and organizing logic functions within the FPGA fabric.
• Embedded Memory — Approximately 6.54 Mbits of on-chip RAM to support buffers, FIFOs, and memory-intensive processing tasks.
• High I/O Count — 488 I/O pins to support wide parallel interfaces and multiple peripheral connections.
• Power — Core voltage supply range of 860 mV to 1.15 V for compatibility with low-voltage system domains.
• Industrial Temperature Range — Rated for operation from −40 °C to 100 °C to meet demanding environmental requirements.
• Package and Mounting — 780-FBGA (29 × 29) FCBGA package with surface-mount mounting type for compact board-level integration.
• RoHS Compliant — Meets RoHS requirements for reduced hazardous substances.

Typical Applications

• Industrial Automation — Implement complex control logic and high-channel I/O processing within extended temperature environments.
• Communications and Networking — Deploy wide parallel interfaces and on-chip memory for packet buffering and custom protocol handling.
• High-Density Digital Systems — Consolidate multiple logic functions into a single FPGA to reduce board space and BOM complexity.

Unique Advantages

• Substantial Logic Resources: 142,500 logic elements enable large-scale custom logic implementations without external ASICs.
• Significant Embedded Memory: Approximately 6.54 Mbits of on-chip RAM reduce reliance on external memory for many buffering and data-processing tasks.
• High Pin Count: 488 I/O pins support multiple high-bandwidth interfaces and parallel data paths.
• Industrial-Rated Operation: −40 °C to 100 °C qualification supports deployment in harsher environmental conditions.
• Compact, Surface-Mount Package: 780-FBGA (29 × 29) package enables dense PCB layouts and reliable board assembly.
• Manufacturer Support: Supplied by Intel as part of the Stratix® III L family, providing continuity in FPGA selection and supply.

Why Choose EP3SL150F780I4?

The EP3SL150F780I4 balances high logic capacity, multi-megabit embedded memory, and a large I/O complement in an industrial-grade FPGA package. Its operating voltage range and extended temperature rating make it suitable for designs that demand both performance and environmental robustness.

This device is well suited for engineers building high-density, memory-intensive systems that require a reliable, compact FPGA solution from a recognized manufacturer. Its combination of logic resources, on-chip RAM, and I/O flexibility delivers long-term design scalability and integration benefits.

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