EP3SL150F780I4LG
| Part Description |
Field Programmable Gate Array (FPGA) IC |
|---|---|
| Quantity | 1,217 Available (as of May 5, 2026) |
| Product Category | Field Programmable Gate Array (FPGA) |
|---|---|
| Manufacturer | Intel |
| Manufacturing Status | Active |
| Manufacturer Standard Lead Time | 26 Weeks |
| Datasheet |
Specifications & Environmental
| Device Package | 780-FBGA (29x29) | Grade | Industrial | Operating Temperature | -40°C – 100°C | ||
|---|---|---|---|---|---|---|---|
| Package / Case | 780-BBGA, FCBGA | Number of I/O | 488 | Voltage | 860 mV - 1.15 V | ||
| Mounting Method | Surface Mount | RoHS Compliance | RoHS Compliant | REACH Compliance | REACH Unaffected | ||
| Moisture Sensitivity Level | 3 (168 Hours) | Number of LABs/CLBs | 5700 | Number of Logic Elements/Cells | 142500 | ||
| Number of Gates | N/A | ECCN | N/A | HTS Code | N/A | ||
| Qualification | N/A | Total RAM Bits | 6543360 |
Overview of EP3SL150F780I4LG – Field Programmable Gate Array (FPGA) IC
The EP3SL150F780I4LG is an Intel Stratix III family Field Programmable Gate Array designed for high-performance logic, digital signal processing and embedded designs. This industrial-grade device combines substantial logic capacity, multi-megabit embedded memory, and a broad I/O set to address demanding communications, networking, and compute‑centric applications.
Key Features
- Logic Capacity 142,500 logic elements provide significant programmable fabric for complex FPGA designs and large-scale logic integration.
- Embedded Memory Approximately 6.54 Mbits of on-chip RAM (6,543,360 bits) for FIFOs, buffers and intermediate data storage.
- I/O Density 488 user I/O pins delivered in a modular I/O organization suitable for interfacing to a variety of external devices and memory subsystems.
- Stratix III Architecture Built on the Stratix III device family architecture (65‑nm process), offering family-level features such as programmable power technology and selectable core voltage for performance/power trade-offs.
- High‑Performance DSP Blocks Family support for dedicated DSP multiplier blocks (including 9×9, 12×12, 18×18 and 36×36 multipliers) enables efficient implementation of signal processing functions.
- Security & Reliability Stratix III family features include optional 256‑bit AES encryption for configuration security, built-in CRC for configuration memory checking, and ECC for on-chip memory error correction.
- Power & Supply Core voltage supply range from 0.86 V to 1.15 V, supporting selectable core voltage operation to balance performance and power.
- Package & Mounting Supplied in a 780‑FBGA (29×29) package (780‑BBGA / FCBGA family variants) and intended for surface-mount assembly.
- Industrial Temperature Grade Rated for operation from −40 °C to 100 °C and RoHS compliant for industrial deployments.
Typical Applications
- High‑Performance DSP & Signal Processing Implement FIR filters, multiply‑accumulate arrays and custom DSP pipelines using dedicated multiplier blocks and dense logic resources.
- Networking & Communications Leverage the Stratix III family’s high‑speed I/O capabilities and programmable fabric for packet processing, protocol bridging and interface conversion.
- Memory Interfaces & Controllers Use abundant I/O and on‑chip memory to build DDR/DDR2/DDR3 and other high‑speed memory controllers and buffer systems (family-level memory interface support available).
- Embedded Systems & Industrial Control Industrial temperature rating, large logic and memory resources make the device suitable for real‑time control, data acquisition and industrial automation functions.
Unique Advantages
- High Logic Density: 142,500 logic elements enable consolidation of complex functions and integration of multiple subsystems into a single device.
- Substantial On‑Chip Memory: Approximately 6.54 Mbits of embedded RAM reduces external memory dependency and improves data throughput.
- Robust I/O Count: 488 user I/Os provide flexible interfacing options to sensors, transceivers and memory devices, simplifying board-level design.
- Configurable Power/Performance: Selectable core voltage and a 0.86–1.15 V supply window allow designers to optimize performance and power consumption.
- Built‑in Security & Reliability: Family-level AES configuration encryption, CRC and ECC features support secure and resilient system operation.
- Industrial Readiness: Surface-mount 780‑FBGA packaging and −40 °C to 100 °C operating range support deployment in industrial environments.
Why Choose EP3SL150F780I4LG?
The EP3SL150F780I4LG brings together a large logic fabric, multi-megabit embedded memory and a broad I/O complement in a single industrial-grade Stratix III FPGA. It is well suited for designs that require substantial on‑chip resources for DSP, protocol processing, memory interfacing and high-throughput data paths while offering configurable power/performance tradeoffs.
This device is targeted at engineering teams building high-performance embedded systems and industrial applications that need scalability, hardware security options and reliability features provided by the Stratix III family and by the device’s industrial temperature rating.
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