EP3SL150F780I4LG

IC FPGA 488 I/O 780FBGA
Part Description

Field Programmable Gate Array (FPGA) IC

Quantity 1,217 Available (as of May 5, 2026)
Product CategoryField Programmable Gate Array (FPGA)
ManufacturerIntel
Manufacturing StatusActive
Manufacturer Standard Lead Time26 Weeks
Datasheet

Specifications & Environmental

Device Package780-FBGA (29x29)GradeIndustrialOperating Temperature-40°C – 100°C
Package / Case780-BBGA, FCBGANumber of I/O488Voltage860 mV - 1.15 V
Mounting MethodSurface MountRoHS ComplianceRoHS CompliantREACH ComplianceREACH Unaffected
Moisture Sensitivity Level3 (168 Hours)Number of LABs/CLBs5700Number of Logic Elements/Cells142500
Number of GatesN/AECCNN/AHTS CodeN/A
QualificationN/ATotal RAM Bits6543360

Overview of EP3SL150F780I4LG – Field Programmable Gate Array (FPGA) IC

The EP3SL150F780I4LG is an Intel Stratix III family Field Programmable Gate Array designed for high-performance logic, digital signal processing and embedded designs. This industrial-grade device combines substantial logic capacity, multi-megabit embedded memory, and a broad I/O set to address demanding communications, networking, and compute‑centric applications.

Key Features

  • Logic Capacity 142,500 logic elements provide significant programmable fabric for complex FPGA designs and large-scale logic integration.
  • Embedded Memory Approximately 6.54 Mbits of on-chip RAM (6,543,360 bits) for FIFOs, buffers and intermediate data storage.
  • I/O Density 488 user I/O pins delivered in a modular I/O organization suitable for interfacing to a variety of external devices and memory subsystems.
  • Stratix III Architecture Built on the Stratix III device family architecture (65‑nm process), offering family-level features such as programmable power technology and selectable core voltage for performance/power trade-offs.
  • High‑Performance DSP Blocks Family support for dedicated DSP multiplier blocks (including 9×9, 12×12, 18×18 and 36×36 multipliers) enables efficient implementation of signal processing functions.
  • Security & Reliability Stratix III family features include optional 256‑bit AES encryption for configuration security, built-in CRC for configuration memory checking, and ECC for on-chip memory error correction.
  • Power & Supply Core voltage supply range from 0.86 V to 1.15 V, supporting selectable core voltage operation to balance performance and power.
  • Package & Mounting Supplied in a 780‑FBGA (29×29) package (780‑BBGA / FCBGA family variants) and intended for surface-mount assembly.
  • Industrial Temperature Grade Rated for operation from −40 °C to 100 °C and RoHS compliant for industrial deployments.

Typical Applications

  • High‑Performance DSP & Signal Processing Implement FIR filters, multiply‑accumulate arrays and custom DSP pipelines using dedicated multiplier blocks and dense logic resources.
  • Networking & Communications Leverage the Stratix III family’s high‑speed I/O capabilities and programmable fabric for packet processing, protocol bridging and interface conversion.
  • Memory Interfaces & Controllers Use abundant I/O and on‑chip memory to build DDR/DDR2/DDR3 and other high‑speed memory controllers and buffer systems (family-level memory interface support available).
  • Embedded Systems & Industrial Control Industrial temperature rating, large logic and memory resources make the device suitable for real‑time control, data acquisition and industrial automation functions.

Unique Advantages

  • High Logic Density: 142,500 logic elements enable consolidation of complex functions and integration of multiple subsystems into a single device.
  • Substantial On‑Chip Memory: Approximately 6.54 Mbits of embedded RAM reduces external memory dependency and improves data throughput.
  • Robust I/O Count: 488 user I/Os provide flexible interfacing options to sensors, transceivers and memory devices, simplifying board-level design.
  • Configurable Power/Performance: Selectable core voltage and a 0.86–1.15 V supply window allow designers to optimize performance and power consumption.
  • Built‑in Security & Reliability: Family-level AES configuration encryption, CRC and ECC features support secure and resilient system operation.
  • Industrial Readiness: Surface-mount 780‑FBGA packaging and −40 °C to 100 °C operating range support deployment in industrial environments.

Why Choose EP3SL150F780I4LG?

The EP3SL150F780I4LG brings together a large logic fabric, multi-megabit embedded memory and a broad I/O complement in a single industrial-grade Stratix III FPGA. It is well suited for designs that require substantial on‑chip resources for DSP, protocol processing, memory interfacing and high-throughput data paths while offering configurable power/performance tradeoffs.

This device is targeted at engineering teams building high-performance embedded systems and industrial applications that need scalability, hardware security options and reliability features provided by the Stratix III family and by the device’s industrial temperature rating.

Request a quote or submit an inquiry to receive pricing and availability for EP3SL150F780I4LG for your next design.

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