EP3SL150F780I4LN

The EP3SL150F780I4LN is a Stratix® III L field programmable gate array (FPGA) in a 780-FBGA (29×29) FCBGA package. It delivers high logic capacity with 142,500 logic elements and 5,700 configurable logic blocks (CLBs), together with approximately 6.54 Mbits of embedded memory and 488 I/O pins.

Built as an industrial-grade, surface-mount device, this FPGA supports a core supply range of 860 mV to 1.15 V and an operating temperature range of -40 °C to 100 °C, providing a compact, high-density option for complex digital designs.

Key Features

• Logic Fabric  5,700 CLBs and 142,500 logic elements provide substantial capacity for large-scale logic integration and complex designs.
• Embedded Memory  Approximately 6.54 Mbits of on-chip RAM enables local buffering and state storage for data-path and control logic.
• I/O Count  488 user I/Os support extensive parallel and serial interfacing options in dense system designs.
• Power Supply  Core operating range from 860 mV to 1.15 V to match modern FPGA power architectures.
• Package & Mounting  780-BBGA, FCBGA (supplier device package: 780-FBGA, 29×29) in a surface-mount form factor for high-density PCB implementations.
• Temperature & Grade  Industrial-grade device rated for operation from -40 °C to 100 °C for demanding environments.
• Environmental Compliance  RoHS compliant.

Unique Advantages

• High integration density: 142,500 logic elements and 5,700 CLBs consolidate complex functions into a single device, reducing system BOM count.
• Significant on-chip memory: Approximately 6.54 Mbits of embedded RAM supports local buffering and state machines without external memory.
• Broad I/O capability: 488 I/O pins accommodate large peripheral sets and multi-interface boards without additional bridge chips.
• Industrial operating range: Rated from -40 °C to 100 °C for consistent operation in industrial environments.
• Compact FCBGA package: 780-FBGA (29×29) enables high-density board layouts while maintaining a surface-mount profile.
• Flexible core voltage support: Operates from 860 mV to 1.15 V to align with contemporary core power rails.

Why Choose EP3SL150F780I4LN?

The EP3SL150F780I4LN combines high logic and memory capacity with extensive I/O and industrial-grade specifications to address demanding digital designs that require consolidation and robust thermal tolerance. Its FCBGA package and surface-mount compatibility make it suitable for compact, high-density PCB assemblies.

This device is well suited for engineers and procurement teams seeking a single-chip, high-capacity FPGA solution with verifiable on-chip resources and industrial temperature performance.

Request a quote or submit an inquiry for pricing and availability of EP3SL150F780I4LN to move your design forward.