EP3SL200F1152C2N

The EP3SL200F1152C2N is a Stratix® III L field programmable gate array (FPGA) in a high-density 1152-ball FCBGA package. It provides a large number of logic elements, substantial embedded RAM, and a high I/O count for designs that require reconfigurable logic and on-chip memory.

Key device attributes include 200,000 logic elements, approximately 10.9 Mbits of total on-chip RAM, 744 I/O pins, low-voltage supply operation, and a commercial operating temperature range of 0 °C to 85 °C.

Key Features

• Core Logic Capacity  Provides 200,000 logic elements to implement complex, high-density digital logic and state machines.
• Embedded Memory  Approximately 10.9 Mbits of on-chip RAM to support buffering, lookup tables, and local data storage without external memory.
• I/O Density  744 available I/O pins to support multiple parallel interfaces, wide buses, and extensive peripheral connectivity.
• Package  1152-ball BGA/FCBGA package (1152-FBGA, 35×35) for compact board-level integration and high pin count in a surface-mount form factor.
• Power  Supports a voltage supply range of 860 mV to 1.15 V to match system power domains and logic core requirements.
• Operating Range & Grade  Commercial temperature rating from 0 °C to 85 °C; surface-mount mounting type for standard PCB assembly processes.
• Compliance  RoHS compliant to meet common environmental requirements for lead-free assembly.

Typical Applications

• High-density digital processing: Use the device's 200,000 logic elements and ~10.9 Mbits of embedded memory to implement complex datapath and control logic for compute- and processing-intensive tasks.
• I/O-intensive interface hubs: Leverage 744 I/O pins to aggregate and bridge multiple parallel or serial interfaces on a single FPGA.
• Custom accelerators: Deploy as an on-board hardware accelerator where large logic capacity and embedded RAM reduce reliance on external processors and memory.
• Embedded system integration: Integrate control, glue logic, and buffering directly on the FPGA to minimize board-level component count and simplify system architecture.

Unique Advantages

• High logic density: 200,000 logic elements enable implementation of large, consolidated designs that would otherwise require multiple devices.
• Substantial on-chip memory: Approximately 10.9 Mbits of embedded RAM supports internal buffering and data staging without external RAM.
• Extensive I/O capability: 744 I/O pins provide flexibility for broad connectivity requirements and parallel signal routing.
• Compact, high-pin-count package: The 1152-ball FCBGA package offers a space-efficient solution for high-density boards while maintaining a large I/O complement.
• Low-voltage core operation: Core supply range of 860 mV to 1.15 V allows integration with modern low-voltage system domains.
• RoHS compliant: Meets lead-free assembly requirements for contemporary manufacturing environments.

Why Choose EP3SL200F1152C2N?

The EP3SL200F1152C2N positions itself as a high-capacity, memory-rich Stratix® III L FPGA suitable for designs that require significant programmable logic, on-chip RAM, and a large number of I/O signals in a compact surface-mount package. Its combination of 200,000 logic elements, approximately 10.9 Mbits of embedded memory, and 744 I/Os makes it appropriate for consolidating complex functions and reducing board-level component count within a commercial temperature range.

Designed for engineers who need substantial integration and configurability, this device supports scalable designs where logic density, embedded memory, and I/O capacity are primary drivers. Its RoHS compliance and standard FCBGA package simplify manufacturing and deployment across a range of commercial applications.

Request a quote or submit a procurement inquiry to obtain pricing and availability for EP3SL200F1152C2N.