EP3SL200F1152C3G

The EP3SL200F1152C3G is a Stratix III family FPGA optimized for high-performance logic, DSP and embedded designs. It combines a large programmable logic fabric with substantial on-chip memory and flexible I/O to address data-centric and compute-intensive applications.

Key architectural characteristics include a 65-nm, 1.1-V SRAM-based FPGA core, support for advanced on-chip power management, and features from the Stratix III device family such as integrated DSP blocks, abundant clocking resources, and optional configuration security.

Key Features

• Logic Capacity  Approximately 200,000 logic elements, providing significant programmable fabric for complex logic and control functions.
• Embedded Memory  Approximately 10.9 Mbits of on-chip RAM to implement buffers, FIFOs and local storage for high-throughput designs.
• DSP and Arithmetic  Stratix III family DSP resources support dedicated multipliers and MAC functions for high-performance digital signal processing and computation.
• I/O and Interfaces  744 user I/O pins in a modular bank structure to support a wide range of industry standards and external memory interfaces; dynamic on-chip termination is supported on I/O banks.
• Clocking and PLLs  Multiple global and regional clock resources and up to 12 PLLs per device for flexible clock synthesis and management.
• Power and Core Voltage  Selectable core voltage operation with a device supply range of 0.86 V to 1.15 V and Programmable Power Technology to help balance performance and power consumption.
• Security and Reliability  Support for 256-bit AES volatile and non-volatile configuration key options and on-chip CRC/ECC mechanisms to help detect and correct configuration or memory errors.
• Package and Mounting  1152-ball FCBGA package (1152-FBGA, 35×35) optimized for surface-mount assembly.
• Commercial Grade  Rated for commercial operation with an operating temperature range of 0 °C to 85 °C and RoHS compliance.

Typical Applications

• High-performance DSP  Signal processing systems that require dedicated multipliers and MAC resources for filtering, modulation or other compute-intensive operations.
• Network and Communications  Protocol and interface implementation that benefit from abundant logic, modular I/O banks and SERDES/DPA support present in the Stratix III architecture.
• Memory Interface Controllers  Controllers for DDR/DDR2/DDR3 and other external memories leveraging the device’s dedicated DQS logic and I/O bank structure.
• Embedded Systems and Acceleration  Custom accelerators and embedded logic that use large on-chip RAM and plentiful logic elements to offload compute from processors.

Unique Advantages

• High logic density: 200,000 logic elements enable integration of complex control, processing and glue logic into a single device, reducing board-level BOM.
• Substantial embedded RAM: Approximately 10.9 Mbits of on-chip memory supports large buffers, FIFOs and local storage for low-latency data paths.
• Dedicated DSP resources: Built-in DSP blocks for efficient implementation of multipliers and MAC operations accelerate signal-processing workloads.
• Flexible clocking: Multiple global and regional clocks plus up to 12 PLLs provide granular control over timing domains and clock synthesis.
• Configurable power profile: Selectable core voltage and Programmable Power Technology enable designers to tune performance versus power consumption.
• Security and data integrity: Optional 256-bit AES configuration key support plus CRC/ECC circuitry help protect and validate configuration and memory contents.

Why Choose EP3SL200F1152C3G?

The EP3SL200F1152C3G brings Stratix III family capabilities—large logic capacity, significant embedded memory and dedicated DSP resources—into a commercial-grade, surface-mount FCBGA package. Its flexible clocking, configurable core voltage range and robust I/O make it suited for demanding communication, DSP and embedded acceleration roles where integration and configurability are priorities.

Design teams seeking a scalable FPGA platform with on-device memory, security options and vendor-supported IP (such as embedded processor and megafunction support in the Stratix III ecosystem) will find this device well suited to prototyping and deployment in performance-focused systems.

Request a quote or submit an inquiry to purchase EP3SL200F1152C3G and evaluate how its logic density, memory and I/O flexibility fit your next design.