EP3SL200F1152C2

The EP3SL200F1152C2 is a Stratix® III L field-programmable gate array (FPGA) offering 200,000 logic elements and substantial on-chip memory for complex programmable-logic designs. The device combines high logic density with a large I/O count and a compact 1152‑FBGA package, making it suitable for designs that require significant embedded logic and connectivity while maintaining a surface-mount form factor.

Key electrical and environmental parameters include a core voltage range of 860 mV to 1.15 V and a commercial operating temperature range of 0 °C to 85 °C. The device is RoHS compliant.

Key Features

• Core Logic  200,000 logic elements provide large programmable logic capacity for complex digital functions and system integration.
• Embedded Memory  Approximately 10.9 Mbits of on-chip RAM to support buffering, FIFOs, and memory‑intensive processing tasks.
• I/O Density  Up to 744 user I/O pins to support extensive peripheral and interface connectivity in a single device.
• Package & Mounting  1152‑FBGA (35×35) / 1152‑BBGA FCBGA package in a surface-mount form factor for compact board-level integration.
• Power  Core voltage supply range from 860 mV to 1.15 V to match system power-architecture requirements.
• Temperature Grade  Commercial operating range: 0 °C to 85 °C, suitable for standard consumer and commercial electronic applications.
• Regulatory  RoHS compliant to meet common environmental requirements for electronic assemblies.

Typical Applications

• High‑density logic systems  Implement complex programmable logic and custom computing functions using the device's 200,000 logic elements.
• Memory‑intensive processing  Use the approximately 10.9 Mbits of embedded RAM for buffering, packet processing, and streaming data tasks.
• I/O‑heavy interface hubs  Support multiple parallel interfaces and peripherals with up to 744 I/O pins for dense connectivity.
• Compact, surface‑mounted designs  Integrate high logic and I/O density into compact PCBs using the 1152‑FBGA surface‑mount package.

Unique Advantages

• Large programmable capacity: 200,000 logic elements enable consolidation of multiple functions into a single FPGA, reducing system component count.
• Substantial on‑chip memory: Approximately 10.9 Mbits of embedded RAM minimizes external memory dependence for many buffering and data‑path applications.
• High I/O count: 744 I/O pins provide flexibility to interface with numerous peripherals and parallel buses without external multiplexing.
• Compact BGA packaging: 1152‑FBGA (35×35) package delivers high pin density in a surface‑mount footprint for space‑constrained boards.
• Low‑voltage core support: Core supply range of 860 mV to 1.15 V supports modern low‑voltage power architectures.
• RoHS compliant: Meets environmental standards for lead‑free assembly and regulatory compliance.

Why Choose EP3SL200F1152C2?

The EP3SL200F1152C2 positions itself as a high‑capacity Stratix® III L FPGA for designs that demand a large pool of logic elements, abundant embedded memory, and a high I/O count within a compact BGA package. Its electrical and package specifications are tailored for commercial applications where integration density and connectivity are priorities.

This device is well suited to engineering teams and OEMs that need to consolidate complex logic functions, implement memory‑heavy data paths, and support numerous external interfaces while maintaining a surface‑mount form factor and RoHS compliance.

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