EP3SL200F1152C2G

IC FPGA 744 I/O 1152FBGA
Part Description

Field Programmable Gate Array (FPGA) IC

Quantity 577 Available (as of May 5, 2026)
Product CategoryField Programmable Gate Array (FPGA)
ManufacturerIntel
Manufacturing StatusActive
Manufacturer Standard Lead Time26 Weeks
Datasheet

Specifications & Environmental

Device Package1152-FBGA (35x35)GradeCommercialOperating Temperature0°C – 85°C
Package / Case1152-BBGA, FCBGANumber of I/O744Voltage860 mV - 1.15 V
Mounting MethodSurface MountRoHS ComplianceRoHS CompliantREACH ComplianceREACH Unaffected
Moisture Sensitivity Level3 (168 Hours)Number of LABs/CLBs8000Number of Logic Elements/Cells200000
Number of GatesN/AECCNN/AHTS CodeN/A
QualificationN/ATotal RAM Bits10901504

Overview of EP3SL200F1152C2G – Field Programmable Gate Array (FPGA) IC

The EP3SL200F1152C2G is a Stratix III family FPGA optimized for high-performance logic, DSP and embedded applications. Built on the Stratix III architecture, it delivers a balance of high logic density, substantial on-chip memory and advanced I/O capabilities for data-path and system-level integration.

Key use cases include high-performance signal processing, complex interface bridging and programmable hardware acceleration in commercial applications. The device combines approximately 200,000 logic elements with roughly 10.9 Mbits of embedded memory, extensive I/O and selectable core-voltage operation to address demanding design requirements.

Key Features

  • Stratix III architecture — Implements the Stratix III family feature set including Programmable Power Technology and selectable core voltage for optimized performance versus power tradeoffs.
  • Logic capacity — Approximately 200,000 logic elements suitable for large-scale logic and control implementations.
  • Embedded memory — Approximately 10.9 Mbits of on-chip RAM for large buffer and state-storage requirements.
  • High-performance DSP support — Family-level support for dedicated DSP blocks and multipliers to accelerate signal-processing and arithmetic-intensive functions.
  • Flexible clocking and PLLs — Stratix III family clocking resources including multiple global, regional and peripheral clocks plus up to 12 PLLs for clock synthesis and deskew.
  • Robust I/O — 744 user I/O pins and modular I/O bank architecture with high-speed differential I/O and SERDES support for demanding interface requirements.
  • Security and reliability — Family features include optional 256-bit AES encryption for configuration security, CRC for configuration memory checking and ECC for on-chip memory protection.
  • Package and mounting — 1152-FBGA (35×35) surface-mount FCBGA package for high-density board integration.
  • Power and operating range — Core supply range from 860 mV to 1.15 V and commercial operating temperature from 0 °C to 85 °C.
  • RoHS compliant — Supplied in a lead-free, RoHS-compliant package.

Typical Applications

  • High-performance signal processing — Implement FIR filters, FFTs and other DSP algorithms using the device’s high logic count and dedicated multiplier resources.
  • Network and communications interfaces — Use the modular I/O banks, SERDES and timing resources to implement high-speed links and protocol bridging.
  • Memory interface controllers — Deploy the on-chip memory and I/O capabilities for DDR/DDR2/DDR3 and other external memory interfaces in packet buffering and data staging roles.
  • Hardware acceleration — Offload compute-intensive tasks from CPUs by implementing custom accelerators and coprocessors in programmable logic.

Unique Advantages

  • Substantial logic and memory in one device: Combines approximately 200,000 logic elements with ~10.9 Mbits of embedded RAM to reduce external memory and component count.
  • Flexible power-performance trade-offs: Selectable core voltage and Programmable Power Technology enable designers to tune the device for required performance or lower power consumption.
  • Comprehensive system-level features: Integrated clocking, PLLs, SERDES and modular I/O simplify complex interface and timing designs.
  • Security and data integrity: Built-in AES configuration encryption, CRC and ECC support protect designs and improve runtime reliability.
  • High-density package: 1152-FBGA (35×35) package supports dense pinout and high I/O counts while enabling surface-mount assembly.

Why Choose EP3SL200F1152C2G?

The EP3SL200F1152C2G positions itself as a high-capacity, system-oriented FPGA offering the Stratix III family’s balance of logic density, embedded memory and I/O flexibility. It is suited for commercial designs that require sizable programmable logic, robust DSP capability and secure configuration options within a surface-mount FBGA package.

Designers benefit from an established family feature set—extensive clocking, PLLs, SERDES support and on-chip memory protection—helping accelerate time-to-market while maintaining scalability and long-term support within the Stratix III ecosystem.

Request a quote or submit an inquiry to obtain pricing, lead times and ordering information for EP3SL200F1152C2G.

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