EP3SL200F1152C3N

The EP3SL200F1152C3N is a Stratix III L family FPGA offering a high-capacity, configurable fabric for demanding digital designs. It combines a large logic resource set with significant on-chip memory and a wide complement of I/O to address compute- and memory‑intensive applications.

Designed for commercial-grade systems, the device provides programmable architecture features documented in the Stratix III device handbook, including embedded memory blocks, DSP blocks, clocking resources and advanced I/O structures that support complex system integration.

Key Features

• Core Logic Approximately 200,000 logic elements to implement large, complex designs and custom logic functions.
• Embedded Memory Approximately 10.9 Mbits of on-chip RAM provided by TriMatrix embedded memory blocks for buffering, FIFOs and local storage.
• I/O Capacity Up to 744 user I/O pins, with support for the device's high-speed differential I/O interfaces and DPA (as described in the Stratix III device handbook).
• DSP Blocks Dedicated DSP resources documented in the family handbook for arithmetic-intensive functions and signal processing pipelines.
• Clocking and PLLs Integrated clock networks and PLL resources for flexible clock distribution and frequency synthesis across the device.
• Configuration and Test Standard configuration options and IEEE 1149.1 (JTAG) boundary-scan testing support as described in the device handbook.
• Design Reliability and Security Family-level features include SEU mitigation strategies and design-security mechanisms referenced in the Stratix III documentation.
• Power and Supply Range Core supply operates in the 860 mV to 1.15 V range, enabling designs that require this specific core-voltage window.
• Package and Mounting Surface-mount 1152‑FBGA (35 × 35) package (listed as 1152‑BBGA, FCBGA) to support compact board-level integration.
• Environmental Compliance and Grade RoHS compliant and specified for commercial operation from 0 °C to 85 °C.

Typical Applications

• High-performance signal processing — Implement DSP pipelines and custom arithmetic blocks using the device's DSP resources and abundant logic capacity.
• Communications and networking equipment — Use the high-speed differential I/O interfaces and extensive I/O pin count for protocol and interface implementations.
• Memory-interface controllers — Leverage on-chip TriMatrix memory and external-memory interface features for controllers and buffering functions.
• Hardware acceleration and prototyping — Deploy the large logic and memory resources for hardware-accelerated compute and FPGA-based prototyping platforms.

Unique Advantages

• Large logic resource — Approximately 200,000 logic elements let you implement sizable, performance-oriented designs without immediate partitioning across multiple devices.
• Substantial embedded memory — Around 10.9 Mbits of on-chip RAM reduces dependence on external memory for many buffering and storage needs.
• Extensive I/O density — 744 I/O pins provide flexibility for multi-interface systems and wide parallel buses.
• Comprehensive family-level features — Architecture features documented in the Stratix III handbook (TriMatrix memory, DSP blocks, clocking, high-speed I/O with DPA) support a broad range of system requirements.
• Commercial operating range with RoHS compliance — Suitable for commercial deployments with defined operating temperature and environmental compliance.
• Standard packaging for board-level integration — 1152‑FBGA package supports compact PCB designs while exposing a high pin count.

Why Choose EP3SL200F1152C3N?

EP3SL200F1152C3N places Stratix III L family architecture into a high-capacity FPGA ideal for designs that need a combination of large logic density, significant on-chip memory and extensive I/O. The device’s documented architecture features such as TriMatrix embedded memory, DSP blocks, programmable clocking and high-speed differential I/O provide the building blocks for compute- and data-intensive applications.

This part is suited to commercial-grade systems where board-level integration, substantial local memory and a high I/O count are decisive factors. Its specifications and family-level documentation enable engineers to plan scalable implementations while maintaining clarity on operating voltage and temperature limits.

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