EP3SL200F1152C4LG

The EP3SL200F1152C4LG is an Intel Stratix III family FPGA packaged in a 1152-ball FCBGA (35×35) surface-mount package. It provides a large programmable fabric with approximately 200,000 logic elements and roughly 10.9 Mbits of embedded memory, aimed at high-performance logic, DSP and embedded system applications.

With a high I/O count and selectable core-voltage operation, this commercial-grade device targets data-centric designs that require dense logic integration, extensive on-chip RAM, and flexible I/O for memory and communication interfaces.

Key Features

• Logic Capacity  Approximately 200,000 logic elements for implementing complex logic, control and DSP functions within a single device.
• Embedded Memory  Approximately 10.9 Mbits of on-chip RAM to support large buffers, FIFOs and local data storage.
• I/O Density  744 user I/Os in a modular-bank package to support wide parallel interfaces and multiple memory/communication channels.
• Package & Mounting  1152-ball FCBGA (35×35) surface-mount package for compact, high-density board integration.
• Core Voltage Range  Selectable core-voltage support with supply range from 0.86 V to 1.15 V for power/performance tradeoffs.
• Operating Range  Commercial operating temperature range of 0 °C to 85 °C.
• Security & Reliability (Series)  Stratix III family features optional 256-bit AES configuration encryption and configuration CRC/ECC circuitry as part of device-level security and reliability.
• Clocking & DSP (Series)  Series-level support for multiple global/regional clocks and dedicated high-speed DSP blocks and PLLs for complex timing and signal-processing tasks.
• Standards & Interfaces (Series)  Stratix III architecture includes high-speed SERDES, dynamic phase alignment and modular I/O bank structures suitable for external memory interfaces and high-speed communications.
• RoHS Compliant  Device is RoHS-compliant for environmental regulatory requirements.

Typical Applications

• High-performance DSP and Signal Processing  Large logic density and embedded memory enable implementation of multi-channel DSP pipelines and FIR filters.
• Networking and Communications  High I/O count and series-level SERDES support make the device suitable for protocol bridging, packet processing and PHY interface logic.
• Memory Interface Controllers  Extensive I/O and on-chip RAM facilitate DDR/DDR2/DDR3 and specialized SRAM interface implementations and buffering.
• Embedded SoC Integration  Use alongside embedded processors (series supports Nios II) for custom acceleration, peripheral aggregation and system glue logic.

Unique Advantages

• High Integration:  Approximately 200,000 logic elements and ~10.9 Mbits of embedded RAM reduce the need for external logic and memory, simplifying BOM and board area.
• Flexible Power/Performance:  Selectable core-voltage operation (0.86 V–1.15 V) enables designers to balance power consumption and performance for the application.
• Extensive I/O Capacity:  744 user I/Os in a 1152-ball FCBGA package provide the signal density required for wide buses and multiple high-speed interfaces.
• Commercial Temperature Rating:  Specified 0 °C to 85 °C operation for a wide range of commercial and enterprise applications.
• Series-Level Security & Reliability:  Stratix III family features such as optional 256-bit AES configuration encryption and ECC/CRC for configuration and memory help protect IP and improve uptime.
• Compact, Surface-Mount Footprint:  35×35 1152-FBGA package supports compact, high-density PCB layouts while enabling robust signal routing.

Why Choose EP3SL200F1152C4LG?

The EP3SL200F1152C4LG positions itself as a high-density Stratix III FPGA option for designers needing a combination of significant logic resources, substantial on-chip memory, and high I/O count in a compact surface-mount package. Its selectable core-voltage operation and series-level power-management features help adapt performance and power to application needs.

This device is well suited for teams building advanced DSP engines, protocol converters, memory controllers, or embedded acceleration blocks that benefit from the Stratix III architecture and its ecosystem of tools and megafunction support.

If you would like pricing, availability or a formal quote for EP3SL200F1152C4LG, submit a request or quote through your standard procurement channel.