EP3SL200F1152C4N

The EP3SL200F1152C4N is a Stratix® III L Field Programmable Gate Array (FPGA) IC from Intel, supplied in a 1152-ball FCBGA package. It delivers high logic density, substantial on-chip embedded memory and a large I/O count for commercial electronic designs that require reconfigurable logic and system-level integration.

Key attributes include approximately 200,000 logic elements, roughly 10.9 Mbits of embedded RAM, 744 I/Os and a 1152-FBGA (35×35) surface-mount package, with support for a core supply range of 0.86 V to 1.15 V and a commercial operating temperature range.

Key Features

• FPGA Core (Stratix® III L) Reconfigurable logic architecture provided in the Stratix® III L family, implemented here with approximately 200,000 logic elements for complex digital designs.
• Embedded Memory Approximately 10.9 Mbits of on-chip RAM to support buffer, state and algorithm storage without external memory in many use cases.
• High I/O Density 744 user I/Os to accommodate wide parallel interfaces and multiple peripheral connections on a single device.
• Package and Mounting 1152-ball FCBGA package (1152-FBGA, 35×35) optimized for board-level integration; surface-mount mounting type for modern PCB assembly flows.
• Power Supply Range Core voltage support from 0.86 V to 1.15 V, enabling designs that target the device’s specified supply window.
• Commercial Temperature Grade Rated for operation from 0 °C to 85 °C, suitable for commercial electronic environments.
• Regulatory Compliance RoHS compliant, supporting lead-free assembly and regulatory requirements for many global markets.

Typical Applications

• Commercial electronic systems — Deployment in designs that require high logic density and significant on-chip memory within a compact BGA footprint.
• High‑pin-count interface aggregation — Use where large numbers of parallel or serial interfaces must be concentrated on a single programmable device thanks to 744 I/Os.
• Complex digital processing — Implement custom processing pipelines or control logic leveraging approximately 200,000 logic elements and ~10.9 Mbits embedded RAM.
• Board-level integration — Suited to designs that require a surface-mount 1152-FBGA package to conserve PCB area while maintaining high integration.

Unique Advantages

• High logic capacity: Approximately 200,000 logic elements allow implementation of large-scale logic functions on a single device, reducing external component count.
• Substantial embedded memory: Around 10.9 Mbits of on-chip RAM supports buffering, state machines and data processing without immediate reliance on external memory.
• Extensive I/O: 744 I/Os provide the connectivity needed for complex multi-interface systems and high-throughput applications.
• Compact, board-ready package: 1152-FBGA (35×35) surface-mount package enables dense PCB layouts and modern assembly techniques.
• Commercial-grade operating range: 0 °C to 85 °C rating aligns with a wide range of commercial product requirements.
• RoHS compliant: Facilitates lead-free manufacturing and helps meet environmental compliance requirements.

Why Choose EP3SL200F1152C4N?

The EP3SL200F1152C4N positions itself as a high-density, commercially graded Stratix® III L FPGA that combines significant logic resources, large embedded memory and a high I/O count in a compact 1152-FBGA surface-mount package. Its electrical and thermal ratings make it suitable for commercial electronic designs that require a programmable, integrated solution to consolidate system logic.

This device is appropriate for engineering teams designing complex digital systems that benefit from high on-chip integration, substantial memory capacity and broad connectivity, while maintaining assembly compatibility with modern BGA-based PCBs.

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