EP3SL200F1152C4LN

The EP3SL200F1152C4LN is a Stratix® III L field-programmable gate array (FPGA) from Intel offering high logic density and a large on-chip memory budget in a compact FCBGA package. It targets designs that require substantial programmable logic capacity, extensive I/O, and low-voltage core operation.

Key value propositions include 200,000 logic elements, approximately 10.9 Mbits of embedded memory, and 744 I/O pins—all delivered in a 1152-FBGA (35×35) / 1152-BBGA surface-mount package with commercial-grade temperature and RoHS compliance.

Key Features

• Core Logic 200,000 logic elements provide high-density programmable logic for complex digital designs.
• Embedded Memory Approximately 10.9 Mbits of on-chip RAM for buffering, temporary storage, and local data processing.
• I/O Capacity 744 general-purpose I/O pins to support wide parallel interfaces and high pin-count connectivity.
• Power and Supply Low-voltage core operation supported across a supply range of 0.86 V to 1.15 V to match platform power requirements.
• Package and Mounting Available in a 1152-FBGA (35×35) / 1152-BBGA (FCBGA) surface-mount package to optimize board density and thermal pathing.
• Temperature and Grade Commercial operating range of 0 °C to 85 °C for typical commercial and industrial-adjacent applications.
• Regulatory RoHS compliant for environmental and manufacturing compatibility.

Typical Applications

• High-density digital systems — Leverages 200,000 logic elements and substantial embedded memory to implement large combinational and sequential logic networks.
• I/O-intensive interfaces — The 744 I/O pins enable integration of multiple parallel buses, wide data paths, or numerous sensor and peripheral connections.
• On-board buffering and local storage — Approximately 10.9 Mbits of embedded RAM supports packet buffering, FIFOs, and temporary data storage close to logic elements.
• Compact platform designs — The 1152-FBGA (35×35) surface-mount package helps reduce PCB footprint while maintaining high connectivity.

Unique Advantages

• High logic capacity: 200,000 logic elements enable integration of complex functionality on a single device, reducing the need for multi-chip solutions.
• Significant on-chip memory: Approximately 10.9 Mbits of embedded RAM minimizes external memory dependence for many buffering and data-path needs.
• Extensive I/O support: 744 I/O pins provide flexibility for wide interfaces and numerous peripherals without additional I/O expander components.
• Compact FCBGA packaging: 1152-FBGA (35×35) / 1152-BBGA surface-mount package conserves board area while supporting high pin counts.
• Low-voltage core: 0.86–1.15 V supply range accommodates low-voltage system architectures.
• RoHS compliant: Meets environmental and manufacturing requirements for lead-free assembly.

Why Choose EP3SL200F1152C4LN?

Manufactured by Intel, the EP3SL200F1152C4LN combines very high logic density, large embedded memory, and an extensive I/O complement in a compact surface-mount FCBGA package. It is well suited for designers who need to consolidate complex logic, substantial on-chip RAM, and broad connectivity into a single FPGA device for commercial-temperature applications.

For projects requiring a commercially graded FPGA with high integration and a low-voltage core profile, this device provides a clear balance of capacity, I/O, and packaging to support scalable, space-efficient designs.

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