EP3SL200F1152I3G

The EP3SL200F1152I3G is an Intel Stratix III family FPGA offering high logic density and on-chip memory in a surface-mount FCBGA package. It targets high-performance logic, digital signal processing (DSP), embedded designs and high-speed communications where configurable hardware and system-level flexibility are required.

This device combines approximately 200,000 logic elements with roughly 10.9 Mbits of embedded memory, extensive I/O and industrial-temperature operation, providing a balance of capacity, integration and robustness for complex FPGA designs.

Key Features

• Core & architecture  Stratix III family architecture built on a 1.1-V, 65-nm all-layer copper SRAM process with programmable power technology and selectable core voltage options.
• Logic capacity  200,000 logic elements to implement complex, high-density programmable logic functions.
• Embedded memory  Approximately 10.9 Mbits of on-chip RAM (10,901,504 bits) for data buffering, FIFOs and memory-intensive functions.
• DSP and clocking  Family-level support for dedicated DSP blocks and multiple clock resources, including up to 12 PLLs and numerous global/regional/peripheral clocks for precise timing and high-speed arithmetic tasks.
• I/O and high-speed interfaces  744 user I/O pins in a modular bank structure to support diverse interface standards and memory interfaces.
• Power and thermal  Core supply range of 0.86 V to 1.15 V and an operating temperature range of −40 °C to 100 °C suitable for industrial applications.
• Security and reliability  Family features include optional 256‑bit AES key support and on-chip error detection/ECC for configuration and memory integrity.
• Package and mounting  1152-BBGA / 1152-FBGA (35 × 35 mm) FCBGA package, surface-mount for board-level integration.
• Compliance  RoHS-compliant device for environmental regulatory requirements.

Typical Applications

• High-performance DSP systems  Implement FIR filters, multiply-accumulate engines and other DSP pipelines using the device’s dedicated DSP resources and large on-chip memory.
• Networking and communications  Build high-throughput packet processors, protocol bridges and interface controllers leveraging the extensive I/O and clocking resources.
• Memory interface controllers  Support DDR/DDR2/DDR3 and other external memory interfaces using modular I/O banks and dedicated memory signaling features.
• Embedded and custom logic  Deploy complex state machines, accelerators and embedded processors where high logic density and configurable hardware reduce system-level BOM and latency.

Unique Advantages

• High logic density: 200,000 logic elements provide the capacity to implement large, integrated designs without partitioning across multiple devices.
• Substantial on-chip memory: Approximately 10.9 Mbits of embedded RAM reduces reliance on external memory for buffering and temporary storage, simplifying board design.
• Broad I/O capability: 744 user I/O pins and modular banks support diverse interface standards and high-pin-count memory interfaces.
• Industrial temperature rating: Rated operation from −40 °C to 100 °C for deployment in demanding environments.
• Flexible power operation: Core supply range of 0.86 V to 1.15 V and programmable power technology for balancing performance and power consumption.
• Built-in security and reliability: Family-level AES key support and ECC/error-detection features help protect configuration data and user memory.

Why Choose EP3SL200F1152I3G?

EP3SL200F1152I3G positions itself as a high-capacity, industrial-grade FPGA solution for system designers who need substantial logic resources, embedded memory and extensive I/O in a single, surface-mount package. The Stratix III family architecture and on-chip reliability/security features provide a solid foundation for DSP, networking and embedded acceleration projects.

This device is suited to teams building scalable, performance-oriented systems that demand integrated memory, programmable power options and operation across a wide temperature range, while remaining compliant with RoHS requirements.

Request a quote or submit an RFQ to receive pricing and availability for the EP3SL200F1152I3G.