EP3SL200F1152I3

The EP3SL200F1152I3 is an Intel Stratix® III L field programmable gate array (FPGA) supplied in a 1152-FBGA (35×35) surface-mount package. It delivers a high-capacity programmable fabric with 200,000 logic elements and approximately 10.9 Mbits of embedded memory, designed for industrial-grade deployments.

With 744 I/Os, a core supply range of 860 mV to 1.15 V, and an extended operating range from −40 °C to 100 °C, this device is intended for systems that require high integration density, extensive I/O, and reliable operation across industrial temperature ranges.

Key Features

• Programmable Logic Capacity — 200,000 logic elements provide substantial resources for complex custom logic, state machines, and datapath implementations.
• On-Chip Memory — Approximately 10.9 Mbits of embedded RAM to support buffering, FIFOs, and on-chip data storage for performance-sensitive functions.
• High I/O Count — 744 user I/Os enable dense interfacing to peripherals, multi-channel sensors, and wide parallel busses without external multiplexing.
• Package and Mounting — 1152-FBGA (35×35) package in a surface-mount form factor for compact board designs and reliable soldered connections.
• Power Supply Range — Core voltage support from 860 mV to 1.15 V to match required system power rails and design constraints.
• Industrial Temperature Grade — Rated for operation from −40 °C to 100 °C to meet temperature demands of industrial environments.
• RoHS Compliant — Meets RoHS environmental requirements for restricted hazardous substances.

Typical Applications

• Industrial Automation — High logic capacity and an industrial temperature rating make this FPGA suitable for control systems and industrial I/O aggregation where extended environmental ranges are required.
• High-Density I/O Systems — With 744 I/Os, the device is well suited for designs requiring many direct interfaces, such as interface bridging, sensor arrays, or complex peripheral integration.
• On-Board Data Processing — Approximately 10.9 Mbits of embedded RAM and large logic resources support on-chip buffering and real-time data handling for embedded processing tasks.

Unique Advantages

• Large Logic Resource: 200,000 logic elements allow implementation of complex algorithms and parallel datapaths without partitioning across multiple devices.
• Extensive I/O Integration: 744 I/Os reduce the need for external multiplexers and interface chips, simplifying board-level design and lowering BOM count.
• Robust On-Chip Memory: Approximately 10.9 Mbits of embedded RAM supports FIFO buffering and local data storage, improving throughput and latency for real-time tasks.
• Industrial Temperature Support: Rated from −40 °C to 100 °C for deployment in demanding environmental conditions common to industrial equipment.
• Compact, Surface-Mount Package: 1152-FBGA (35×35) packaging enables high-density placement on modern PCBs while supporting reliable solder mount assembly.
• RoHS Compliance: Meets environmental regulations for restricted substances, supporting regulatory and procurement requirements.

Why Choose EP3SL200F1152I3?

The EP3SL200F1152I3 combines a high logic element count, substantial embedded memory, and an exceptionally large I/O complement in a compact, industrial-grade FBGA package. These characteristics make it a compelling choice for engineers designing complex, I/O-heavy systems that must operate reliably across extended temperature ranges.

Ideal for industrial automation and other demanding embedded applications, this FPGA offers designers a highly integrated platform that reduces external components, supports on-chip data handling, and aligns with industry environmental requirements—providing scalability and robustness for long-term deployments.

Request a quote or submit an inquiry to receive pricing and availability information for EP3SL200F1152I3 and to discuss how this FPGA can fit your next design.