EP3SL200F1152C4L

The EP3SL200F1152C4L is a Stratix® III L Field Programmable Gate Array (FPGA) IC from Intel, supplied in a 1152-BBGA (FCBGA) package. It integrates a large logic fabric with significant on-chip RAM and a high I/O count for board-level designs.

With 200,000 logic elements, approximately 10.9 Mbits of embedded memory and 744 I/O, this device targets designs that require substantial logic capacity, dense memory resources and broad I/O connectivity while meeting commercial-grade temperature and supply requirements.

Key Features

• Core Logic 200,000 logic elements provide the programmable fabric for implementing complex digital logic and custom functions.
• Embedded Memory Approximately 10.9 Mbits of on-chip RAM for buffering, state storage and memory-intensive logic structures.
• I/O Capacity 744 I/O pins to support wide parallel buses, numerous peripherals and high-pin-count interfaces at the board level.
• Package & Mounting Available in a 1152-BBGA (FCBGA) package, supplier package 1152-FBGA (35×35), optimized for surface-mount assembly.
• Power Core supply operating range from 860 mV to 1.15 V to match system power-rail planning and design constraints.
• Operating Range Commercial-grade temperature range of 0 °C to 85 °C for typical business and consumer electronics environments.
• Compliance RoHS compliant.
• Manufacturer Intel-sourced Stratix® III L FPGA.

Typical Applications

• High-density logic designs — Implement complex, large-scale programmable logic functions using up to 200,000 logic elements.
• Memory-intensive designs — Leverage approximately 10.9 Mbits of embedded RAM for buffering, FIFOs and on-chip data storage.
• Wide I/O interfacing — Employ 744 I/O pins for parallel interfaces, multiple peripherals and board-level connectivity.
• Surface-mount system integration — Use the 1152-BBGA FCBGA package for compact, high-density PCB layouts.

Unique Advantages

• Substantial logic capacity: 200,000 logic elements enable implementation of feature-rich programmable designs without immediate migration to multiple devices.
• Significant on-chip memory: Approximately 10.9 Mbits of RAM reduces external memory dependency for many buffering and data-path tasks.
• Extensive I/O resources: 744 I/O pins support complex interfacing scenarios and high-pin-count system requirements.
• Compact FCBGA package: 1152-BBGA (35×35) format supports high-density PCB integration and surface-mount manufacturing.
• Commercial operating range: Rated for 0 °C to 85 °C to match mainstream electronics deployment environments.
• RoHS compliant supply: Meets common environmental compliance expectations for commercial products.

Why Choose EP3SL200F1152C4L?

The EP3SL200F1152C4L positions itself as a commercially graded Stratix® III L FPGA offering a balanced combination of large logic capacity, substantial embedded memory and extensive I/O resources in a compact FCBGA package. It is well suited for designers and OEMs who need on-chip resources to consolidate functionality and simplify board-level designs.

Backed by Intel manufacturing, this device delivers clear, specification-driven value for development teams working on logic-dense, memory-aware and I/O-intensive applications that operate within commercial temperature and supply constraints.

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