EP3SL200F1152C4

The EP3SL200F1152C4 is an Intel Stratix® III L Field Programmable Gate Array supplied in a 1152‑pin ball grid array (FBGA) package. It provides a high-density programmable fabric with 200,000 logic elements and substantial on-chip RAM for demanding digital designs.

With a core voltage range of 860 mV to 1.15 V, up to 744 user I/Os, surface-mount BGA packaging, and commercial temperature grading (0 °C to 85 °C), this FPGA is suited for compact, high‑I/O, memory‑rich applications where board space and integration are priorities.

Key Features

• Core Logic  200,000 logic elements provide dense programmable logic resources for complex combinational and sequential functions.
• Embedded Memory  Approximately 10.9 Mbits of on‑chip RAM to support buffers, FIFOs, and local data storage without external memory.
• I/O Capacity  Up to 744 user I/O pins enable high‑pin‑count interfaces and parallel connectivity to peripherals and daughtercards.
• Power  Core supply operating range from 860 mV to 1.15 V to match system power rails and enable optimized power delivery designs.
• Package & Mounting  1152‑BBGA (35 × 35 mm FBGA) surface‑mount package for compact board integration and high I/O density.
• Operating Temperature  Commercial grade operation from 0 °C to 85 °C for standard temperature environments.
• Environmental Compliance  RoHS compliant to meet lead‑free assembly and regulatory requirements.

Typical Applications

• High‑density logic consolidation  Integrate complex digital functions into a single device using 200,000 logic elements to reduce component count and board complexity.
• Memory‑intensive processing  Use the approximately 10.9 Mbits of embedded RAM for packet buffering, data staging, and on‑chip storage in real‑time systems.
• High‑I/O interface modules  Deploy up to 744 I/Os for multi‑lane parallel interfaces, wide buses, or multiple peripheral connections on compact PCBs.
• Compact BGA designs  The 1152‑FBGA (35×35) surface‑mount package supports high‑density board layouts where space and signal routing are constrained.

Unique Advantages

• High integration density: 200,000 logic elements and substantial embedded RAM reduce the need for external logic and memory, simplifying BOM and layout.
• Large I/O headroom: 744 user I/Os support multiple parallel interfaces or high channel counts without multiplexing compromises.
• Compact package form factor: The 1152‑FBGA (35×35) package enables a small footprint implementation while maintaining high pin count.
• Low‑voltage core compatibility: Broad core supply range (860 mV to 1.15 V) allows flexible power‑rail integration with modern system designs.
• RoHS compliant: Meets lead‑free assembly requirements for environmentally conscious manufacturing processes.

Why Choose EP3SL200F1152C4?

The EP3SL200F1152C4 positions itself as a high‑capacity, commercially graded FPGA for designs needing substantial programmable logic, on‑chip memory, and large I/O count in a compact BGA package. Its combination of 200,000 logic elements, approximately 10.9 Mbits of embedded RAM, and 744 I/Os makes it suitable for system designs that prioritize integration and board‑level consolidation.

Ideal for engineering teams targeting compact, high‑I/O digital subsystems, this device delivers a balance of density, power compatibility, and RoHS compliance to support scalable designs and standard commercial deployments.

Request a quote or submit a purchase inquiry to obtain pricing, availability, and lead‑time information for the EP3SL200F1152C4.