EP3SL200F1152C3

The EP3SL200F1152C3 is a Stratix® III L Field Programmable Gate Array (FPGA) IC designed for commercial-grade applications requiring high logic capacity and extensive I/O. With 200,000 logic elements and support for up to 744 I/O pins, this device targets designs that need large-scale programmable logic and substantial on-chip memory.

Packaged in a 1152-BBGA (FCBGA) 35×35 format and RoHS compliant, the device offers a compact, surface-mount solution with a core supply range of 860 mV to 1.15 V and an operating temperature range of 0 °C to 85 °C.

Key Features

• Core Capacity  200,000 logic elements provide a high-density programmable fabric for complex digital logic integration.
• On‑Chip Memory  Approximately 10.9 Mbits of embedded RAM (10,901,504 total RAM bits) for data buffering, state storage, and on-chip buffering needs.
• I/O Density  Up to 744 I/O pins support extensive external interfacing and high-pin-count system designs.
• Package & Mounting  1152-BBGA FCBGA (supplier device package: 1152-FBGA 35×35) in a surface-mount form factor for compact board-level integration.
• Power  Core voltage supply range of 860 mV to 1.15 V to match system power-rail requirements within the specified range.
• Temperature & Grade  Commercial-grade device rated for operation from 0 °C to 85 °C.
• Compliance  RoHS compliant for environmentally responsible designs.

Typical Applications

• Commercial embedded systems  Use the EP3SL200F1152C3 where high logic capacity and many I/O are required within commercial temperature limits.
• High-density I/O interfacing  Up to 744 I/O pins allow complex external device interfacing and board-level integration with many peripherals.
• Memory‑intensive logic  Approximately 10.9 Mbits of embedded RAM support on-chip buffering and state storage for logic-heavy designs.

Unique Advantages

• Substantial logic resources: 200,000 logic elements enable implementation of large programmable designs without immediate migration to larger families.
• Ample embedded memory: Approximately 10.9 Mbits of on-chip RAM reduces dependency on external memory for many design tasks.
• High I/O count: 744 I/O pins simplify board routing for systems that require multiple parallel interfaces or high-pin connectivity.
• Compact BGA package: The 1152-BBGA (35×35) FCBGA package delivers high-pin density in a space-efficient surface-mount footprint.
• Commercial readiness: Rated for 0 °C to 85 °C and RoHS compliant for deployment in commercial products and assemblies.

Why Choose EP3SL200F1152C3?

The EP3SL200F1152C3 combines a high logic element count, substantial on-chip RAM, and a large I/O complement in a compact 1152-BBGA FCBGA package, making it suitable for commercial designs that require dense programmable logic and broad interfacing capability. Its electrical and thermal ratings provide predictable behavior across typical commercial operating conditions.

This part is well suited for teams designing complex programmable systems that need significant embedded memory and I/O without sacrificing board space. RoHS compliance and surface-mount packaging support streamlined manufacturing and regulatory alignment for commercial products.

Request a quote or submit an inquiry to receive pricing and availability for the EP3SL200F1152C3 and to discuss how it can fit your next FPGA design.