EP3SL150F780I4N

The EP3SL150F780I4N is a Stratix® III L field programmable gate array (FPGA) delivered in a 780-BBGA / 780-FBGA package. It integrates a high-density logic fabric with substantial embedded RAM and a large I/O count to support complex digital designs.

Built and rated for industrial use, this device targets applications that require abundant logic resources, approximately 6.54 Mbits of on-chip memory, and a broad I/O footprint, while offering a compact surface-mount 29×29 mm package and a wide operating temperature range.

Key Features

• Core Logic 142,500 logic elements providing a high-density programmable fabric for complex logic implementations.
• Embedded Memory Approximately 6.54 Mbits of on-chip RAM to support buffering, state storage, and data processing tasks.
• High I/O Count 488 I/O pins to connect multiple peripherals, sensors, and high-pin-count interfaces.
• Package 780-BBGA, FCBGA package (supplier device package: 780-FBGA, 29×29 mm) optimized for surface-mount assembly.
• Power Core voltage supply range of 860 mV to 1.15 V for system power planning and compatibility with modern power rails.
• Industrial Temperature Range Rated for operation from −40 °C to 100 °C to meet demanding environmental conditions.
• Assembly Surface mount mounting type suitable for automated PCB assembly processes.
• Compliance RoHS compliant, supporting regulatory and environmental requirements for electronic assemblies.

Typical Applications

• Industrial Control and Automation — Leverage the large logic capacity and extensive I/O to implement motor control, PLC functions, and real-time signal processing.
• High-Density Data Processing — Use the embedded RAM and dense logic resources for packet buffering, custom data-paths, and protocol handling.
• Communication Interfaces — Implement multi-channel interface bridging and protocol translation where many I/Os and programmable logic are required.

Unique Advantages

• High Logic Density: 142,500 logic elements deliver the capacity needed for complex, integrated digital systems, reducing the need for multiple discrete devices.
• Substantial On-Chip Memory: Approximately 6.54 Mbits of embedded RAM enable local buffering and fast data access without external memory dependencies.
• Large I/O Count: 488 I/Os provide flexibility to interface with numerous peripherals, sensors, and high-pin-count connectors directly.
• Industrial-Rated Operation: Rated for −40 °C to 100 °C operation, suitable for harsh or temperature-variable environments.
• Compact Surface-Mount Packaging: 780-FBGA (29×29 mm) package optimizes board area while supporting automated assembly.
• RoHS Compliant: Meets common environmental regulatory requirements for modern electronic products.

Why Choose EP3SL150F780I4N?

The EP3SL150F780I4N positions itself as a high-density, industrial-grade FPGA platform that combines a large logic resource pool, ample embedded memory, and a broad I/O set in a compact surface-mount package. Its voltage and temperature specifications make it suitable for demanding embedded systems and industrial designs that require reliable, scalable programmable logic.

This device is ideal for designers and procurement teams seeking a single-chip solution to consolidate logic, memory, and I/O functionality—helping reduce board-level complexity and supporting long-term deployment in environments with wide temperature swings and RoHS requirements.

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