EP3SL150F780I4L

The EP3SL150F780I4L is a Stratix® III L Field Programmable Gate Array (FPGA) designed for industrial applications that require high-density programmable logic and extensive I/O. It combines a large logic capacity with substantial on-chip memory and a high pin count in a 780-ball FCBGA package to support complex, board-level programmable designs.

Key Features

• Core Capacity — Provides 5,700 LABs (approximately 142,500 logic elements) to implement complex combinational and sequential logic functions.
• Embedded Memory — Contains approximately 6.54 Mbits of on-chip RAM for buffering, FIFOs, and state storage within user logic.
• High I/O Count — 488 device I/O pins enable dense external interfacing for sensors, peripherals, and parallel interfaces.
• Voltage Range — Operates from 0.860 V to 1.15 V supply, matching system power domains that use core supply voltages in this range.
• Package and Mounting — Supplied in a 780‑BBGA (FCBGA) package; supplier device package listed as 780‑FBGA (29×29) for surface-mount assembly.
• Industrial Temperature Range — Rated for −40 °C to 100 °C operation to meet many industrial environmental requirements.
• RoHS Compliant — Conforms to RoHS requirements for lead-free manufacturing processes.

Typical Applications

• Industrial Control — Use the device’s large logic capacity and 488 I/O to implement complex control algorithms, digital I/O expansion, and sensor interfacing within industrial automation systems.
• Embedded Systems — Implement custom accelerators, glue logic, and protocol adapters where on-chip memory and high logic density are required.
• Communications and Networking Hardware — Leverage abundant logic elements and I/O for protocol processing, packet handling, and board-level interfacing.

Unique Advantages

• High Logic Integration: With approximately 142,500 logic elements, the device supports large, integrated designs that reduce the need for multiple discrete logic devices.
• Substantial Embedded Memory: Approximately 6.54 Mbits of on-chip RAM enables localized buffering and state storage, simplifying external memory requirements.
• Extensive I/O Resources: 488 I/O pins provide the connectivity needed for complex multi-peripheral systems and dense board-level interfaces.
• Industrial Temperature Rating: Operation from −40 °C to 100 °C supports deployment in a wide range of industrial environments.
• Surface-Mount FCBGA Package: The 780-ball FCBGA (29×29) package offers a compact, high-density solution for modern PCB designs.
• RoHS Compliance: Enables use in lead-free manufacturing processes and aligns with common environmental requirements.

Why Choose EP3SL150F780I4L?

The EP3SL150F780I4L positions itself as a high-capacity, industrial-grade FPGA option that balances dense logic resources, meaningful on-chip memory, and a large I/O complement in a compact FCBGA package. It is well suited for engineers designing industrial control systems, embedded platforms, and communications equipment that require scalable programmable logic and reliable operation across a broad temperature range.

Backed by the Stratix® III L product lineage from Intel, the device offers a clear upgrade path for designs needing substantial logic and memory integration while meeting RoHS environmental requirements.

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