EP3SL150F780I3N

The EP3SL150F780I3N is a Stratix® III L field programmable gate array (FPGA) from Intel, delivering large-scale programmable logic and embedded memory in a 780-ball FCBGA package. It provides a high-density combination of logic elements, on-chip RAM, and I/O resources targeted at complex, integration-heavy designs that require industrial-grade temperature capability.

Key Features

• Core Density — 142,500 logic elements to implement large combinational and sequential logic networks.
• Embedded Memory — Approximately 6.54 Mbits of on-chip RAM to support buffering, lookup tables, and state storage without external memory.
• I/O Capacity — 488 I/O pins for broad system interfacing and high pin-count connectivity.
• Power Supply — Operates from 0.860 V to 1.15 V supply rails, supporting optimized core power configurations.
• Package & Mounting — 780-BBGA FCBGA package (780-FBGA, 29×29) in a surface-mount form factor for compact board integration.
• Industrial Grade & Temperature Range — Rated industrial grade with an operating temperature range of −40 °C to 100 °C for deployment in demanding environments.
• Regulatory Compliance — RoHS compliant, meeting common lead-free requirements for electronic assembly.

Typical Applications

• High‑density logic integration — Leverage 142,500 logic elements to consolidate multiple logic functions and reduce overall system complexity.
• Memory-intensive FPGA designs — Use approximately 6.54 Mbits of embedded RAM for on-chip buffering, LUT-based storage, and state machines.
• Industrial systems — Industrial-grade rating and −40 °C to 100 °C operating range suit control and monitoring equipment operating across wide temperature extremes.

Unique Advantages

• High integration density: Large logic-element count combined with substantial on-chip RAM reduces dependence on external components and simplifies board-level design.
• Extensive I/O: 488 I/O pins provide the flexibility to interface with multiple peripherals and high-pin-count subsystems without additional bridging chips.
• Compact surface-mount package: 780-FBGA (29×29) packaging enables a small PCB footprint for space-constrained applications while maintaining thermal and electrical performance.
• Industrial temperature capability: Rated from −40 °C to 100 °C to support deployment in harsh or temperature-variable environments.
• Controlled core power range: 0.860 V to 1.15 V operating supply range allows predictable power design and integration into optimized power architectures.
• RoHS compliance: Conforms to lead-free manufacturing requirements for modern electronics production.

Why Choose EP3SL150F780I3N?

The EP3SL150F780I3N combines significant programmable logic capacity, substantial embedded memory, and broad I/O in a compact 780-FBGA surface-mount package, making it well suited for designs that demand high integration and industrial temperature tolerance. As a member of the Stratix® III L family from Intel, it targets projects requiring predictable hardware resources—142,500 logic elements, approximately 6.54 Mbits of on-chip RAM, and 488 I/Os—while supporting lead-free, industrial-grade deployment.

This device is appropriate for engineers and procurement teams developing high-density digital systems where on-chip memory and extensive I/O reduce BOM complexity and streamline board-level design. Its combination of density, package, and temperature rating delivers long-term value for scalable, robust designs.

Request a quote or submit an inquiry to check pricing, availability, and to get tailored support for integrating the EP3SL150F780I3N into your next design.