EP3SL150F780I3

The EP3SL150F780I3 is an industrial-grade Stratix® III L FPGA manufactured by Intel. It provides a high logic element count and substantial on-chip memory in a 780-ball FCBGA package for compact, surface-mount system designs.

With a broad I/O complement and a low-voltage core supply range, this device targets industrial and embedded applications that require dense logic integration, significant embedded RAM, and reliable operation across a wide temperature range.

Key Features

• Core Logic Density — Approximately 142,500 logic elements, supporting complex combinational and sequential logic implementations.
• Embedded Memory — Approximately 6.54 Mbits of on-chip RAM to support buffering, state storage, and small embedded data sets without external memory.
• I/O Capacity — 488 I/Os to accommodate wide peripheral interfacing and parallel connectivity requirements.
• Power Supply — Core voltage supply range of 860 mV to 1.15 V for compatibility with low-voltage system designs.
• Package & Mounting — 780-ball FC-BGA (29 × 29 mm supplier package) in a surface-mount form factor for high-density PCB integration.
• Industrial Temperature Range — Rated for operation from −40°C to 100°C to meet demanding environmental conditions.
• Regulatory Compliance — RoHS compliant, supporting environmental and manufacturing requirements.

Typical Applications

• Industrial Control — Implements custom logic for motor control, PLC I/O aggregation, and machine automation where industrial temperature operation and high logic density are required.
• Signal Processing — On-chip RAM and large logic capacity support data buffering and custom signal-processing pipelines in embedded systems.
• High-Density I/O Systems — The 488 I/Os enable complex sensor arrays, parallel interfaces, and board-level aggregation for instrumentation and test equipment.

Unique Advantages

• High logic capacity: Approximately 142,500 logic elements allow implementation of substantial custom logic without partitioning across multiple devices.
• Significant on-chip memory: Approximately 6.54 Mbits of embedded RAM reduces dependence on external memory for many buffering and storage tasks.
• Large I/O count: 488 I/Os simplify integration with multiple peripherals, sensors, and parallel interfaces, reducing the need for external multiplexing.
• Industrial-grade thermal range: Rated −40°C to 100°C for dependable operation in harsh or temperature-variable environments.
• Compact, surface-mount package: 780-FBGA (29×29) enables high-density PCB layouts while maintaining a robust soldered connection.
• RoHS compliant: Meets common environmental regulations for lead-free manufacturing and assembly.

Why Choose EP3SL150F780I3?

The EP3SL150F780I3 combines substantial logic capacity, ample embedded memory, and a wide I/O complement in an industrial-temperature, surface-mount package—making it well suited for engineers designing dense, reliable embedded and industrial systems. Its low-voltage core supply and compact 780-ball FCBGA footprint help optimize board-level power and space while enabling complex, integrated logic functions.

This device is appropriate for projects that require scalability in logic and memory resources, robust operation across a wide temperature range, and a high pin count for system-level connectivity.

Request a quote or submit an inquiry to obtain pricing and availability for EP3SL150F780I3.